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F28M35H22B1RFPQ

Texas Instruments

F28M35H22B1RFPQ by Texas Instruments

The Texas Instruments F28M35H22B1RFPQ microcontroller features a 32-bit CPU, 74 I/O lines, and 139264 bytes of RAM. With a max clock frequency of 20 MHz, it is suitable for automotive applications requiring high-speed processing and control capabilities. This microcontroller also offers ADC and DAC channels for analog signal processing in automotive systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,911 parts In-Stock

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6,911

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Digiode

USA . 3,741 parts In-Stock

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3,741

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Distributors (Availability)

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Native Components

USA . 453 parts In-Stock

1+ parts

$0.124

100+ parts

-

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$0.119

453

$0.124

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$0.119

Northwest PG Solutions

USA . 1,196 parts In-Stock

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$0.137

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$0.121

1,196

$0.137

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$0.121

AZTECH Wire

Italy . 260 parts In-Stock

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$8.524

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260

$8.524

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One Stop Electronics

USA . 330 parts In-Stock

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$33.000

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330

$33.000

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Parana Technologies

USA . 148 parts In-Stock

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$65.914

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148

$65.914

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ChromeModa Solutions

Germany . 2,677 parts In-Stock

1+ parts

$74.061

100+ parts

$60.730

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2,677

$74.061

$60.730

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IDEA Electronic Components Group

UK . 16 parts In-Stock

1+ parts

$74.061

100+ parts

$70.358

1k+ parts

$66.655

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16

$74.061

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$66.655

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Corphita

USA . 2,680 parts In-Stock

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2,680

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DigiPath Technology Company

USA . 1,519 parts In-Stock

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$66.773

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1,519

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$66.773

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Overview

Elevate your projects with the F28M35H22B1RFPQ microcontroller by Texas Instruments. Designed with precision and reliability in mind, this powerful Cortex-M3 CPU family device offers unmatched performance for a wide range of applications. With features like DAC and ADC channels, PWM channels, and DMA capabilities, this microcontroller provides endless possibilities for innovation. Whether you're working on automotive, industrial, or consumer electronics projects, this microcontroller's advanced technology and high-quality manufacturing ensure seamless operation and optimal results. Trust Texas Instruments to deliver cutting-edge solutions that push the boundaries of what's possible.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the microcontroller suitable for various environments and applications.

Maximum Supply Voltage: 1.26 V

Ability to operate at a higher voltage range allows for flexibility in power supply options.

Package Shape: SQUARE

Square package shape enables efficient use of PCB space and alignment with other components.

Bit Size: 32

32-bit processing capability provides high performance and efficient data handling.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple power supply options allows for versatile integration in different systems.

ADC Channels: YES

Integrated ADC channels enable analog signal input, expanding the range of possible applications.

ROM Words: 524288

Large ROM size allows for ample storage of program instructions and data.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications, ensuring reliability under challenging environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing and control capabilities for diverse applications.

RAM Bytes: 139264

Generous RAM capacity facilitates efficient data processing and storage.

Technical Specifications

Microcontrollers F28M35H22B1RFPQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F28M35H22B1RFPQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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