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F28M35H32B1RFPT

Texas Instruments

F28M35H32B1RFPT by Texas Instruments

The Texas Instruments F28M35H32B1RFPT microcontroller features a 32-bit CPU, 74 I/O lines, and 139264 bytes of RAM. With a max clock frequency of 20 MHz, it is suitable for industrial applications requiring high-speed processing and control capabilities. This microcontroller also offers DAC and ADC channels along with PWM functionality for precise analog signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,258 parts In-Stock

1+ parts

-

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7,258

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Digiode

USA . 2,252 parts In-Stock

1+ parts

-

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2,252

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$12.379

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$12.379

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One Stop Electronics

USA . 343 parts In-Stock

1+ parts

$25.000

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-

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-

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343

$25.000

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Parana Technologies

USA . 1,934 parts In-Stock

1+ parts

$57.542

100+ parts

$5,343.653

1k+ parts

$51.788

10k+ parts

-

1,934

$57.542

$5,343.653

$51.788

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DigiPath Technology Company

USA . 1,089 parts In-Stock

1+ parts

$63.361

100+ parts

-

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1,089

$63.361

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ChromeModa Solutions

Germany . 4,167 parts In-Stock

1+ parts

$64.654

100+ parts

$53.016

1k+ parts

-

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4,167

$64.654

$53.016

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IDEA Electronic Components Group

UK . 184 parts In-Stock

1+ parts

$64.654

100+ parts

$61.421

1k+ parts

$58.189

10k+ parts

-

184

$64.654

$61.421

$58.189

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Native Components

USA . 85 parts In-Stock

1+ parts

$445.500

100+ parts

$436.590

1k+ parts

$432.135

10k+ parts

$427.680

85

$445.500

$436.590

$432.135

$427.680

Northwest PG Solutions

USA . 504 parts In-Stock

1+ parts

$490.050

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504

$490.050

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Corphita

USA . 411 parts In-Stock

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411

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Overview

Experience the next level of performance and efficiency with the F28M35H32B1RFPT microcontroller by Texas Instruments. Crafted with precision and expertise, this microcontroller offers a wide range of applications in various industries, providing unmatched reliability and versatility. Enhance your projects with seamless integration, superior power management, and advanced features that deliver exceptional value and performance. Trust Texas Instruments to bring you cutting-edge technology that exceeds expectations and drives innovation. Elevate your designs with the F28M35H32B1RFPT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microcontroller suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.26 V

Provides a safe operating range for the microcontroller and ensures stable performance.

Package Shape: SQUARE

The square shape helps in efficient placement and routing of the microcontroller on the PCB.

Bit Size: 32

Higher bit size allows for faster processing and handling of complex tasks.

DAC Channels: YES

The presence of DAC channels allows for analog signal generation, making the microcontroller versatile.

Maximum Operating Temperature: 105 °C

Can operate in high-temperature environments, making it suitable for industrial applications.

CPU Family: CORTEX-M3

Cortex-M3 architecture offers high performance and energy efficiency for embedded applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing and reduces power consumption, ideal for embedded systems.

RAM Bytes: 139264

Ample RAM allows for efficient multitasking and data storage, enhancing the microcontroller's performance.

Technical Specifications

Microcontrollers F28M35H32B1RFPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

F28M35H32B1RFPT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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