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F28M36H53C2ZWTQ

Texas Instruments

F28M36H53C2ZWTQ by Texas Instruments

The Texas Instruments F28M36H53C2ZWTQ microcontroller features a peak reflow temperature of 260°C and a max time at peak reflow temperature of 30s. This CMOS technology-based peripheral IC is ideal for applications requiring high processing power and reliability, such as industrial automation systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,742 parts In-Stock

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Digiode

USA . 1,189 parts In-Stock

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1,189

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Distributors (Availability)

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AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$7.513

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878

$7.513

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One Stop Electronics

USA . 542 parts In-Stock

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$16.000

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542

$16.000

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Parana Technologies

USA . 206 parts In-Stock

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$71.041

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206

$71.041

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DigiPath Technology Company

USA . 676 parts In-Stock

1+ parts

$78.225

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$71.967

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676

$78.225

$71.967

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ChromeModa Solutions

Germany . 2,858 parts In-Stock

1+ parts

$79.821

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$65.453

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2,858

$79.821

$65.453

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IDEA Electronic Components Group

UK . 2,281 parts In-Stock

1+ parts

$79.821

100+ parts

$75.830

1k+ parts

$71.839

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2,281

$79.821

$75.830

$71.839

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Corphita

USA . 4,835 parts In-Stock

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Native Components

USA . 704 parts In-Stock

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704

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Microchip USA

USA . 377 parts In-Stock

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377

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Northwest PG Solutions

USA . 53 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the F28M36H53C2ZWTQ Microcontroller by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers reliable and durable products that are perfect for a variety of applications. Whether you're working on robotics, industrial control systems, or automotive electronics, this microcontroller offers unmatched value, benefits, and advantages to help you bring your projects to life. Trust Texas Instruments to provide the cutting-edge technology you need to succeed in today's fast-paced world of electronics.

Feature Benefit Bullets

Terminal Finish TIN

Tin terminal finish provides good solderability, making it easier to assemble and maintain the product

Terminal Finish SILVER

Silver terminal finish offers excellent conductivity, ensuring reliable electrical connections in the microcontroller

Terminal Finish COPPER

Copper terminal finish provides corrosion resistance, enhancing the longevity of the microcontroller

Maximum Time At Peak Reflow Temperature (s) 30

Short reflow time reduces the risk of thermal damage to sensitive components during manufacturing

Peak Reflow Temperature °C 260

High peak reflow temperature ensures proper soldering and component bonding for a reliable end product

Peripheral IC Type MICROCONTROLLER, RISC

RISC architecture in a microcontroller offers efficient performance and power consumption, making it suitable for various applications

Technology CMOS

CMOS technology provides low power consumption and high noise immunity, improving the overall efficiency of the microcontroller

Moisture Sensitivity Level (MSL) 3

MSL 3 indicates that the microcontroller can be exposed to moderate reflow conditions without damaging its sensitive components

Technical Specifications

Microcontrollers F28M36H53C2ZWTQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

F28M36H53C2ZWTQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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