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DM388AAARD21F

Texas Instruments

DM388AAARD21F by Texas Instruments

Texas Instruments DM388AAARD21F microprocessor features 32-bit architecture, 1.42V max supply voltage, and 30MHz clock frequency. Ideal for high-performance applications requiring low power consumption and integrated cache memory. Suitable for use in various electronic devices due to its compact size and advanced technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,353 parts In-Stock

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8,353

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Digiode

USA . 4,678 parts In-Stock

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4,678

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,379 parts In-Stock

1+ parts

$1.000

100+ parts

-

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1,379

$1.000

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AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$10.703

100+ parts

-

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512

$10.703

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One Stop Electronics

USA . 1,488 parts In-Stock

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$19.000

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1,488

$19.000

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Native Components

USA . 14 parts In-Stock

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$23.872

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14

$23.872

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Northwest PG Solutions

USA . 541 parts In-Stock

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$26.259

100+ parts

$23.633

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541

$26.259

$23.633

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Microchip USA

USA . 1,822 parts In-Stock

1+ parts

$28.320

100+ parts

$27.920

1k+ parts

$27.710

10k+ parts

$27.510

1,822

$28.320

$27.920

$27.710

$27.510

Parana Technologies

USA . 559 parts In-Stock

1+ parts

$33.450

100+ parts

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$125.619

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559

$33.450

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$125.619

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DigiPath Technology Company

USA . 714 parts In-Stock

1+ parts

$36.832

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714

$36.832

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ChromeModa Solutions

Germany . 6,100 parts In-Stock

1+ parts

$37.584

100+ parts

$30.819

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6,100

$37.584

$30.819

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IDEA Electronic Components Group

UK . 1,639 parts In-Stock

1+ parts

$37.584

100+ parts

$35.705

1k+ parts

$33.826

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1,639

$37.584

$35.705

$33.826

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Corphita

USA . 971 parts In-Stock

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971

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Overview

Experience unparalleled performance and reliability with the Texas Instruments DM388AAARD21F microprocessor. Crafted by a trusted industry leader, this cutting-edge technology is perfect for a wide range of applications. With integrated cache, advanced features, and high-quality construction, this microprocessor delivers exceptional value and benefits to customers. Whether you're looking to enhance your computing power or streamline your operations, the DM388AAARD21F is the perfect choice for all your needs. Trust in Texas Instruments for top-notch quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the microprocessor lightweight and durable, which is important for portability and longevity.

Integrated Cache: YES

Having integrated cache helps improve the microprocessor's performance by storing frequently accessed data closer to the processor, reducing access times and enhancing overall speed.

Maximum Supply Voltage: 1.42 V

The microprocessor's maximum supply voltage of 1.42V ensures stable and reliable performance without risking damage due to overvoltage.

Address Bus Width: 28

With a wide address bus width of 28 bits, the microprocessor can handle larger memory addressing, allowing it to access a larger range of memory locations for processing data efficiently.

Bit Size: 32

The 32-bit architecture of the microprocessor enables it to process larger chunks of data at a time, leading to faster and more efficient processing capabilities.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature of 95°C indicates the microprocessor's ability to handle intensive computational tasks without overheating, ensuring reliable performance under demanding conditions.

RAM Words: 655360

The microprocessor's large RAM capacity of 655360 words allows for efficient data storage and manipulation, enabling smooth multitasking and processing of large datasets.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it excels in executing simple instructions quickly, making it ideal for high-speed processing tasks.

Technology: CMOS

The CMOS technology used in the microprocessor ensures low power consumption while maintaining high performance levels, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Microprocessors DM388AAARD21F attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

609

On Chip Data RAM Width:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

655360

Maximum Seated Height:

1.32 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM388AAARD21F Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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