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CC430F5123IRGZT

Texas Instruments

CC430F5123IRGZT by Texas Instruments

CC430F5123IRGZT by Texas Instruments is a 16-bit microprocessor with 2/3.3V power supplies, 20MHz clock frequency, and 2048 bytes of RAM. Ideal for industrial applications, it features I2C, SPI, UART, USB bus compatibility and a TIMER peripheral for efficient operations in various electronic systems.

Median Price

$4.284

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,000 parts In-Stock

1+ parts

$5.008

100+ parts

$4.083

1k+ parts

$2.722

10k+ parts

-

3,000

$5.008

$4.083

$2.722

-

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$3.400

1k+ parts

$3.040

10k+ parts

$2.860

250

-

$3.400

$3.040

$2.860

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.319

10k+ parts

$4.128

250

-

-

$4.319

$4.128

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

$3.800

10k+ parts

$3.575

250

-

$4.250

$3.800

$3.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,580 parts In-Stock

1+ parts

$3.591

100+ parts

-

1k+ parts

-

10k+ parts

-

3,580

$3.591

-

-

-

Vyrian

USA . 7,525 parts In-Stock

1+ parts

-

100+ parts

-

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7,525

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 852 parts In-Stock

1+ parts

$3.210

100+ parts

-

1k+ parts

-

10k+ parts

-

852

$3.210

-

-

-

Corphita

USA . 832 parts In-Stock

1+ parts

$3.402

100+ parts

-

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10k+ parts

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832

$3.402

-

-

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Parana Technologies

USA . 2,045 parts In-Stock

1+ parts

$13.220

100+ parts

-

1k+ parts

$13.724

10k+ parts

-

2,045

$13.220

-

$13.724

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DigiPath Technology Company

USA . 1,748 parts In-Stock

1+ parts

$14.557

100+ parts

$13.392

1k+ parts

-

10k+ parts

-

1,748

$14.557

$13.392

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-

ChromeModa Solutions

Germany . 4,232 parts In-Stock

1+ parts

$14.854

100+ parts

$12.180

1k+ parts

-

10k+ parts

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4,232

$14.854

$12.180

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-

IDEA Electronic Components Group

UK . 1,807 parts In-Stock

1+ parts

$14.854

100+ parts

$14.111

1k+ parts

$13.369

10k+ parts

-

1,807

$14.854

$14.111

$13.369

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Corohmni

South Africa . 495 parts In-Stock

1+ parts

$27.232

100+ parts

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1k+ parts

-

10k+ parts

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495

$27.232

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-

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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100+ parts

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3,500

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Northwest PG Solutions

USA . 2,036 parts In-Stock

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2,036

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Lixinc

USA . 1,370 parts In-Stock

1+ parts

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1,370

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Native Components

USA . 208 parts In-Stock

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208

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Overview

Enhance your electronic designs with the CC430F5123IRGZT from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This versatile microprocessor circuit is perfect for a wide range of applications, offering customers the value of high performance and efficiency. With features like low power consumption and a maximum clock frequency of 20 MHz, this chip carrier can bring your projects to the next level. Upgrade your systems with the CC430F5123IRGZT and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits inside the package.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Bit Size: 16

Offers sufficient computational capabilities for a variety of applications.

Power Supplies (V): 2/3.3

Compatible with common power supply voltages, making integration easier.

No. of Terminals: 48

Plenty of connection options for interfacing with other components in a system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile packaging options for different installation and cooling needs.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, suitable for industrial applications.

CPU Family: MSP430

Part of a well-established and reliable family of microcontrollers, ensuring compatibility and support.

Maximum Clock Frequency: 20 MHz

Offers fast processing speeds for real-time applications.

RAM Bytes: 2048

Adequate memory for storing data and variables during operation.

Technology: CMOS

Low power consumption and reliable operation in various conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F5123IRGZT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART; USB

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Peripherals:

TIMER

Trade Compliance

CC430F5123IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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