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AM5K2E04XABD25

Texas Instruments

AM5K2E04XABD25 by Texas Instruments

AM5K2E04XABD25 by Texas Instruments is a microprocessor with integrated cache and 64-bit external data bus width. It operates b/w 0-85°C, has a terminal pitch of 0.8mm, and supports boundary scan technology. Ideal for applications requiring high-speed processing in compact devices.

Median Price

$155.801

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 187 parts In-Stock

1+ parts

$122.892

100+ parts

$119.196

1k+ parts

$92.400

10k+ parts

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187

$122.892

$119.196

$92.400

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Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$188.710

100+ parts

$147.820

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-

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5

$188.710

$147.820

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,061 parts In-Stock

1+ parts

$116.747

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1,061

$116.747

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Vyrian

USA . 2,827 parts In-Stock

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2,827

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Distributors (Availability)

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Northwest PG Solutions

USA . 918 parts In-Stock

1+ parts

$3.199

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-

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918

$3.199

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Parana Technologies

USA . 1,990 parts In-Stock

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$52.460

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-

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1,990

$52.460

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DigiPath Technology Company

USA . 129 parts In-Stock

1+ parts

$57.765

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129

$57.765

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ChromeModa Solutions

Germany . 5,418 parts In-Stock

1+ parts

$58.944

100+ parts

$48.334

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5,418

$58.944

$48.334

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IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$58.944

100+ parts

$55.997

1k+ parts

$53.050

10k+ parts

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883

$58.944

$55.997

$53.050

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Corphita

USA . 1,631 parts In-Stock

1+ parts

$110.603

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1,631

$110.603

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Native Components

USA . 179 parts In-Stock

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$2.821

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179

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$2.821

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Perfect Parts

USA . 45 parts In-Stock

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45

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Component Stockers USA

USA . 31 parts In-Stock

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31

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Overview

Experience the power of cutting-edge technology with the AM5K2E04XABD25 by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments delivers top-quality products that exceed industry standards. Ideal for a wide range of applications, this microprocessor offers seamless integration, high performance, and low power consumption. Say goodbye to compromise and hello to efficiency with the AM5K2E04XABD25.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache improves the overall performance and speed of the microprocessor.

Maximum Supply Voltage: 1.05 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 16

Having a wider address bus allows for faster communication between components.

No. of Terminals: 1089

The high number of terminals enables connectivity to a wide range of external devices and peripherals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even under demanding conditions.

RAM Words: 2097152

With a large RAM capacity, the microprocessor can handle complex tasks and multitasking efficiently.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers improved performance for specific applications through streamlined instruction sets.

Technology: CMOS

Using CMOS technology results in lower power consumption and higher speed, contributing to overall efficiency.

External Data Bus Width: 64

Having a wide external data bus allows for faster data transfer between the microprocessor and external components.

Technical Specifications

Microprocessors AM5K2E04XABD25 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

5

No. of Terminals:

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

RAM Words:

2097152

Maximum Seated Height:

3.55 mm

Speed:

1250 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E04XABD25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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