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AM5726BABCX

Texas Instruments

AM5726BABCX by Texas Instruments

AM5726BABCX by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode and features a CMOS technology with RISC architecture for efficient processing.

Median Price

$77.340

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 249 parts In-Stock

1+ parts

$60.369

100+ parts

$53.662

1k+ parts

$39.457

10k+ parts

-

249

$60.369

$53.662

$39.457

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Mouser Electronics

USA . 14 parts In-Stock

1+ parts

$94.310

100+ parts

$69.820

1k+ parts

-

10k+ parts

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14

$94.310

$69.820

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,751 parts In-Stock

1+ parts

$57.351

100+ parts

-

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10k+ parts

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4,751

$57.351

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Vyrian

USA . 8,591 parts In-Stock

1+ parts

-

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-

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8,591

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,401 parts In-Stock

1+ parts

$3.190

100+ parts

-

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-

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1,401

$3.190

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Parana Technologies

USA . 1,053 parts In-Stock

1+ parts

$48.311

100+ parts

-

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10k+ parts

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1,053

$48.311

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-

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DigiPath Technology Company

USA . 2,247 parts In-Stock

1+ parts

$53.196

100+ parts

$48.941

1k+ parts

-

10k+ parts

-

2,247

$53.196

$48.941

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ChromeModa Solutions

Germany . 6,820 parts In-Stock

1+ parts

$54.282

100+ parts

$44.511

1k+ parts

-

10k+ parts

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6,820

$54.282

$44.511

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IDEA Electronic Components Group

UK . 916 parts In-Stock

1+ parts

$54.282

100+ parts

$51.568

1k+ parts

$48.854

10k+ parts

-

916

$54.282

$51.568

$48.854

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Corphita

USA . 4,516 parts In-Stock

1+ parts

$54.332

100+ parts

-

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4,516

$54.332

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QUARKTWIN TECHNOLOGY LTD

USA . 14,968 parts In-Stock

1+ parts

-

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14,968

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Native Components

USA . 215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.813

10k+ parts

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215

-

-

$2.813

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Perfect Parts

USA . 39 parts In-Stock

1+ parts

-

100+ parts

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39

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Overview

Enhance your product designs with the AM5726BABCX by Texas Instruments. As a trusted manufacturer of high-quality microprocessors, Texas Instruments delivers reliable performance and innovative solutions for a wide range of applications. With advanced features and a durable package body material, this microprocessor offers exceptional value and benefits to customers seeking cutting-edge technology. Experience the advantages of this powerful component in your next project and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product, making it a good choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the microprocessor, making it user-friendly.

Maximum Supply Voltage: 1.2 V

Low supply voltage helps in reducing power consumption and heat generation, leading to better energy efficiency.

Address Bus Width: 16

Having a wider address bus allows for faster data transfer and processing, enhancing the performance of the microprocessor.

No. of Terminals: 760

Having a high number of terminals enables greater connectivity options and flexibility in integrating the microprocessor with other components.

Maximum Operating Temperature: 90 °C

The high operating temperature range ensures stable performance even in harsh environmental conditions, making it a reliable choice for industrial applications.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes it suitable for use in a wide range of environments, from cold storage facilities to outdoor settings.

Terminal Finish: TIN SILVER COPPER

This finish provides a strong and reliable connection, ensuring efficient data transmission and reducing the risk of signal loss or interference.

External Data Bus Width: 32

With a wider external data bus, the microprocessor can handle larger volumes of data simultaneously, improving overall processing speed and efficiency.

Maximum Clock Frequency: 38.4 MHz

A high clock frequency allows for fast data processing and multitasking capabilities, making the microprocessor suitable for demanding computing tasks.

Technical Specifications

Microprocessors AM5726BABCX attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.55 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5726BABCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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