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AM3356BZCZA30

Texas Instruments

AM3356BZCZA30 by Texas Instruments

AM3356BZCZA30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. It is ideal for industrial applications requiring low power mode, featuring a terminal pitch of 0.8 mm and operating temperature range from -40 to 105 °C.

Median Price

$17.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,112 parts In-Stock

1+ parts

$13.859

100+ parts

$12.106

1k+ parts

$8.349

10k+ parts

-

9,112

$13.859

$12.106

$8.349

-

Mouser Electronics

USA . 126 parts In-Stock

1+ parts

$20.140

100+ parts

$12.210

1k+ parts

$12.000

10k+ parts

-

126

$20.140

$12.210

$12.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,413 parts In-Stock

1+ parts

$13.166

100+ parts

-

1k+ parts

-

10k+ parts

-

2,413

$13.166

-

-

-

Vyrian

USA . 2,754 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,754

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,743 parts In-Stock

1+ parts

$12.473

100+ parts

-

1k+ parts

-

10k+ parts

-

1,743

$12.473

-

-

-

Component Stockers USA

USA . 9,396 parts In-Stock

1+ parts

$17.480

100+ parts

$13.360

1k+ parts

$9.070

10k+ parts

-

9,396

$17.480

$13.360

$9.070

-

Parana Technologies

USA . 193 parts In-Stock

1+ parts

$51.742

100+ parts

-

1k+ parts

-

10k+ parts

-

193

$51.742

-

-

-

DigiPath Technology Company

USA . 2,294 parts In-Stock

1+ parts

$56.974

100+ parts

-

1k+ parts

-

10k+ parts

-

2,294

$56.974

-

-

-

ChromeModa Solutions

Germany . 2,231 parts In-Stock

1+ parts

$58.137

100+ parts

$47.672

1k+ parts

-

10k+ parts

-

2,231

$58.137

$47.672

-

-

IDEA Electronic Components Group

UK . 111 parts In-Stock

1+ parts

$58.137

100+ parts

$55.230

1k+ parts

$52.323

10k+ parts

-

111

$58.137

$55.230

$52.323

-

Northwest PG Solutions

USA . 1,061 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,061

-

-

-

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Native Components

USA . 341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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341

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Overview

Elevate your projects with the AM3356BZCZA30 microprocessor by Texas Instruments, a top-tier manufacturer known for quality and innovation. Ideal for a wide range of applications, this powerful chip offers integrated cache, low power mode, and boundary scan capabilities. With a 32-bit architecture and impressive RAM words, this product delivers unmatched performance and reliability. Experience seamless operation and exceptional value with the AM3356BZCZA30, setting a new standard in microprocessor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, ensuring long-term reliability.

Integrated Cache: YES

Having an integrated cache enhances the performance of the microprocessor by reducing memory latency and increasing processing speed.

Maximum Supply Voltage: 1.144 V

The maximum supply voltage of 1.144 V ensures safe operation and prevents damage to the microprocessor.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data processing and storage within the microprocessor.

Address Bus Width: 28

With a 28-bit address bus width, the microprocessor can access a large memory space, making it suitable for complex computing tasks.

Package Shape: SQUARE

The square package shape allows for easy integration and placement of the microprocessor on a circuit board.

Bit Size: 32

The 32-bit architecture enables the microprocessor to handle larger chunks of data at once, enhancing overall performance.

Power Supplies (V): 0.95/1.1

Having multiple power supply options (0.95V and 1.1V) allows for flexibility in power management and energy efficiency.

No. of Terminals: 324

Having 324 terminals provides a high level of connectivity and versatility for interfacing with other components in a system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style optimizes space on the circuit board, making it ideal for compact devices.

Minimum Supply Voltage: 1.056 V

The minimum supply voltage of 1.056 V ensures stable operation and allows for power-efficient performance of the microprocessor.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this microprocessor is suitable for industrial applications that require high temperature tolerance.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the installation and connection process of the microprocessor within a system.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm makes this microprocessor suitable for thin and compact electronic devices.

RAM Words: 131072

With 131072 RAM words, the microprocessor can efficiently store and process a large amount of data, enhancing its computing capabilities.

Width: 15 mm

The compact width of 15 mm allows for easy integration of the microprocessor into various electronic devices with space constraints.

Boundary Scan: YES

Having boundary scan capability allows for easy testing and debugging of the microprocessor, ensuring high reliability and quality control.

External Data Bus Width: 16

The 16-bit external data bus width enables efficient communication with external devices, enhancing the overall performance of the microprocessor.

Maximum Clock Frequency: 26 MHz

The maximum clock frequency of 26 MHz allows for high-speed processing and real-time applications, making this microprocessor a good choice for demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this microprocessor can withstand soldering processes without compromising its functionality.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering of the microprocessor onto the circuit board, maintaining electrical connections.

Length: 15 mm

The compact length of 15 mm allows for space-saving integration of the microprocessor in electronic devices without compromising performance.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades indicates that this microprocessor is designed to operate reliably in harsh industrial environments with wide temperature fluctuations.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC microprocessor, this product offers high performance, energy efficiency, and simplicity in design, making it suitable for a wide range of applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making this microprocessor energy-efficient and reliable for long-term use.

Terminal Form: BALL

The ball terminal form provides robust electrical connections and ease of soldering during the assembly process, ensuring reliable performance of the microprocessor.

Maximum Supply Current: 400 mA

The maximum supply current of 400 mA allows for efficient power management and prevents overloading the microprocessor, ensuring stable operation.

Nominal Supply Voltage: 1.1 V

Having a nominal supply voltage of 1.1 V ensures stable and optimal performance of the microprocessor in various operating conditions.

No. of DMA Channels: 64

With 64 DMA channels, this microprocessor can efficiently transfer data between peripherals and memory, enhancing overall system performance.

Terminal Pitch: 0.8 mm

The narrow terminal pitch of 0.8 mm allows for a high density of terminals, facilitating compact design and space-saving integration of the microprocessor.

Format: FIXED POINT

Having a fixed-point format simplifies arithmetic operations and improves processing efficiency, making this microprocessor suitable for real-time applications.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates that this microprocessor has a moderate level of sensitivity to moisture during storage and soldering processes, requiring standard handling procedures.

Speed: 300 rpm

With a speed of 300 rpm, this microprocessor can handle high-speed data processing and communication tasks, making it ideal for demanding applications.

Low Power Mode: YES

The low power mode feature allows the microprocessor to conserve energy and extend battery life, making it suitable for portable and battery-powered devices.

Technical Specifications

Microprocessors AM3356BZCZA30 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT MIN 0.912 V

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3356BZCZA30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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