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AM3356BZCEA60

Texas Instruments

AM3356BZCEA60 by Texas Instruments

AM3356BZCEA60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

Median Price

$10.860

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 395 parts In-Stock

1+ parts

$10.860

100+ parts

$9.486

1k+ parts

$6.542

10k+ parts

-

395

$10.860

$9.486

$6.542

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,014 parts In-Stock

1+ parts

$10.317

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-

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4,014

$10.317

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Classic Components Corporation

USA . 9,841 parts In-Stock

1+ parts

-

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9,841

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Vyrian

USA . 7,586 parts In-Stock

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7,586

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 544 parts In-Stock

1+ parts

$0.920

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-

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544

$0.920

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Northwest PG Solutions

USA . 165 parts In-Stock

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$1.012

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165

$1.012

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Corphita

USA . 83 parts In-Stock

1+ parts

$9.774

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83

$9.774

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AZTECH Wire

Italy . 274 parts In-Stock

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$17.890

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274

$17.890

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Parana Technologies

USA . 1,512 parts In-Stock

1+ parts

$56.586

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1,512

$56.586

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DigiPath Technology Company

USA . 2,190 parts In-Stock

1+ parts

$62.308

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2,190

$62.308

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ChromeModa Solutions

Germany . 6,924 parts In-Stock

1+ parts

$63.580

100+ parts

$52.136

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6,924

$63.580

$52.136

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IDEA Electronic Components Group

UK . 336 parts In-Stock

1+ parts

$63.580

100+ parts

$60.401

1k+ parts

$57.222

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336

$63.580

$60.401

$57.222

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Futuretech Components

Singapore . 8,888 parts In-Stock

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8,888

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Overview

Unleash the power of cutting-edge technology with the AM3356BZCEA60 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability. This microprocessor offers integrated cache and a wide range of applications, making it the perfect choice for your next project. With a focus on value and performance, this product provides numerous benefits and advantages to customers looking to stay ahead of the curve. Upgrade your system with the AM3356BZCEA60 and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for the product, making it a good choice for long-term use.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microprocessor, making it a good choice for performance-driven applications.

Maximum Supply Voltage: 1.248 V

Operates efficiently at a maximum supply voltage of 1.248 V, providing stable power consumption and optimal performance.

Address Bus Width: 28

With a wide address bus width of 28, the microprocessor can access and process a large amount of memory quickly, making it suitable for high-speed data processing tasks.

Bit Size: 32

A 32-bit microprocessor allows for efficient handling of data and instructions in a single clock cycle, making it suitable for multitasking and complex computing tasks.

RAM Words: 131072

With a large RAM capacity of 131072 words, the microprocessor can handle multiple data operations simultaneously, making it a reliable choice for memory-intensive applications.

Speed: 600 rpm

Operating at a speed of 600 rpm, the microprocessor can deliver fast and responsive performance, making it suitable for time-sensitive applications.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption when the microprocessor is not operating at its full capacity, making it energy-efficient and suitable for portable devices.

Technical Specifications

Microprocessors AM3356BZCEA60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

298

On Chip Data RAM Width:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

131072

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.248 V

Minimum Supply Voltage:

1.152 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM3356BZCEA60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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