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AM1810EZWTA3

Texas Instruments

AM1810EZWTA3 by Texas Instruments

The Texas Instruments AM1810EZWTA3 microprocessor features 32-bit architecture, 131072 RAM words, and a max clock frequency of 50 MHz. Ideal for industrial applications requiring low power consumption, it offers a wide operating temperature range from -40 to 105 °C and supports boundary scan testing.

Median Price

$24.954

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 905 parts In-Stock

1+ parts

$24.954

100+ parts

$22.182

1k+ parts

$16.310

10k+ parts

-

905

$24.954

$22.182

$16.310

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,545 parts In-Stock

1+ parts

$23.706

100+ parts

-

1k+ parts

-

10k+ parts

-

4,545

$23.706

-

-

-

Vyrian

USA . 7,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,180

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 511 parts In-Stock

1+ parts

$8.192

100+ parts

-

1k+ parts

-

10k+ parts

-

511

$8.192

-

-

-

Northwest PG Solutions

USA . 1,319 parts In-Stock

1+ parts

$9.011

100+ parts

$8.110

1k+ parts

-

10k+ parts

-

1,319

$9.011

$8.110

-

-

Parana Technologies

USA . 222 parts In-Stock

1+ parts

$17.628

100+ parts

-

1k+ parts

$17.818

10k+ parts

-

222

$17.628

-

$17.818

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AZTECH Wire

Italy . 247 parts In-Stock

1+ parts

$18.970

100+ parts

-

1k+ parts

-

10k+ parts

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247

$18.970

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-

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ChromeModa Solutions

Germany . 2,747 parts In-Stock

1+ parts

$19.807

100+ parts

$16.242

1k+ parts

-

10k+ parts

-

2,747

$19.807

$16.242

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-

IDEA Electronic Components Group

UK . 689 parts In-Stock

1+ parts

$19.807

100+ parts

$18.817

1k+ parts

$17.826

10k+ parts

-

689

$19.807

$18.817

$17.826

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Corphita

USA . 2,467 parts In-Stock

1+ parts

$22.459

100+ parts

-

1k+ parts

-

10k+ parts

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2,467

$22.459

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,000

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-

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DigiPath Technology Company

USA . 1,147 parts In-Stock

1+ parts

-

100+ parts

$17.858

1k+ parts

-

10k+ parts

-

1,147

-

$17.858

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-

Overview

Experience top-notch performance and reliability with the AM1810EZWTA3 by Texas Instruments, a leading manufacturer in the industry. This microprocessor is perfect for a wide range of applications, offering seamless integration and superior functionality. With advanced features like integrated cache and low power mode, this product provides unmatched value and benefits to customers looking for high-quality solutions. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and pushes boundaries in innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage during installation.

Integrated Cache: YES

Having integrated cache improves the overall performance of the microprocessor by reducing the access time to frequently used data and instructions.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage allows for stable and efficient operation of the microprocessor within safe voltage limits.

On Chip Data RAM Width: 8

With a wide data RAM width, the microprocessor can handle and process larger amounts of data at a faster rate.

Address Bus Width: 14

A wider address bus width allows the microprocessor to access and communicate with a larger memory space, enhancing its overall performance.

Package Shape: SQUARE

The square package shape makes the microprocessor easy to mount and align on circuit boards, optimizing space usage and heat dissipation.

Bit Size: 32

A 32-bit microprocessor offers higher computational capabilities and efficiency compared to lower bit sizes, making it suitable for various computing tasks.

No. of Terminals: 361

Having a high number of terminals increases connectivity options and allows for more input and output capabilities in the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and efficient design, making it suitable for applications where space-saving and high performance are crucial.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage ensures that the microprocessor can operate efficiently even under low power conditions, providing energy-saving benefits.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microprocessor can withstand challenging environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures that the microprocessor can operate reliably in harsh cold environments without compromising its functionality.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent electrical conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

Having terminals at the bottom facilitates easy installation and secure connections, making the microprocessor suitable for various mounting options.

Maximum Seated Height: 1.4 mm

A low maximum seated height allows the microprocessor to be installed in slim devices and compact spaces, increasing its versatility in different applications.

RAM Words: 131072

With a large RAM capacity, the microprocessor can efficiently store and access a vast amount of data, enhancing its multitasking and processing capabilities.

Width: 16 mm

The compact width of the microprocessor makes it suitable for space-constrained applications without compromising its performance and functionality.

Boundary Scan: YES

Having boundary scan capabilities allows for efficient testing and debugging of the microprocessor, ensuring optimal performance and reliability.

External Data Bus Width: 16

A wide external data bus width enables faster data transfer rates and efficient communication with external devices, enhancing the overall performance of the microprocessor.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency enables the microprocessor to execute instructions at a fast rate, making it suitable for demanding computing tasks and applications.

Maximum Time At Peak Reflow Temperature (s): 30

This short time at peak reflow temperature ensures that the microprocessor undergoes proper soldering without being subjected to excessive heat, ensuring its reliability and longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows the microprocessor to withstand harsh soldering processes and ensures proper connection with the circuit board, enhancing its durability.

Length: 16 mm

The compact length of the microprocessor makes it suitable for small form factor devices and space-constrained applications, without compromising its performance.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures that the microprocessor can operate reliably in harsh industrial environments without performance degradation.

Peripheral IC Type: MICROPROCESSOR, RISC

Featuring a RISC architecture in a microprocessor allows for efficient and streamlined processing of instructions, optimizing performance and speed.

Technology: CMOS

Using CMOS technology in the microprocessor offers low power consumption, high speed, and low noise operation, making it suitable for energy-efficient and high-performance applications.

Terminal Form: BALL

Having ball terminals allows for easy and secure connections, providing a reliable interface between the microprocessor and the circuit board or other components.

Maximum Supply Current: 0.31 mA

The low maximum supply current indicates the microprocessor's energy efficiency and power-saving capabilities, making it suitable for battery-powered devices and other low-power applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable and reliable operation of the microprocessor within optimal voltage range, maximizing its performance and efficiency.

No. of DMA Channels: 64

Having a high number of DMA channels allows for efficient data transfer and processing, enhancing the microprocessor's performance in handling multiple tasks simultaneously.

Terminal Pitch: 0.8 mm

The small terminal pitch facilitates compact design and efficient connections, making the microprocessor suitable for applications where space-saving and high density are essential.

Format: FIXED POINT

The fixed point format allows for efficient arithmetic operations and precise calculations, making the microprocessor suitable for applications that require high accuracy and performance.

Moisture Sensitivity Level (MSL): 3

Having a moderate moisture sensitivity level ensures that the microprocessor can withstand standard handling and storage conditions without risk of moisture-induced damage.

Speed: 375 rpm

With a high speed rating, the microprocessor can efficiently execute instructions and process data at a fast rate, enhancing its performance in demanding computing tasks.

Low Power Mode: YES

Featuring a low power mode enhances the microprocessor's energy efficiency and power-saving capabilities, making it suitable for battery-operated devices and other low-power applications.

Technical Specifications

Microprocessors AM1810EZWTA3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

14

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

375 rpm

Maximum Supply Current:

.31 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1810EZWTA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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