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VS6502V015

STMicroelectronics

VS6502V015 by STMicroelectronics

VS6502V015 from STMicroelectronics is a CMOS image sensor featuring a pixel size of 5.6x5.6 µm, operates at 3.3 V with a max temp of 70 °C, and supports I2C output. It delivers 30 fps at a dynamic range of 52 dB, ideal for imaging applications in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,614 parts In-Stock

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4,614

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Digiode

USA . 4,210 parts In-Stock

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4,210

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Anansix

USA . 2,115 parts In-Stock

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2,115

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EMSNET

USA . 608 parts In-Stock

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608

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,963 parts In-Stock

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$2.230

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$2.007

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1,963

$2.230

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$2.007

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MKK Technologies

India . 1,803 parts In-Stock

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$4.194

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1,803

$4.194

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DigiPath Technology Company

USA . 1,803 parts In-Stock

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$4.194

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1,803

$4.194

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Corphita

USA . 3,758 parts In-Stock

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3,758

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Parana Technologies

USA . 199 parts In-Stock

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$2.666

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Overview

Unlock a world of brilliant imaging with the VS6502V015 from STMicroelectronics, a leader in innovative technology. This high-quality CMOS image sensor delivers exceptional performance across various applications, from surveillance to smart devices. With its impressive dynamic range and reliable operation in diverse conditions, it ensures stunning clarity and precision. Experience the value of superior quality and cutting-edge design that empowers your projects to stand out.

Feature Benefit Bullets

Pixel Size: 5.6x5.6 um

The compact pixel size allows for high-resolution imaging while maximizing sensitivity.

Maximum Supply Voltage: 3.6 V

Supports a common supply voltage, ensuring compatibility with a wide range of devices.

Master Clock: 24 MHz

A higher clock frequency enhances processing speed, enabling real-time applications.

Body Width: 8.66 inch

The compact design makes it suitable for space-constrained applications.

Power Supplies: 3.3 V

Utilizes a standard voltage supply that is efficient for power consumption.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS technology provides low power consumption and high integration capabilities.

Body Height: 5.8 mm

The low profile facilitates integration into compact devices and enclosures.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easier mounting and fitting in various applications.

Minimum Supply Voltage: 2.6 V

Operating at a lower voltage increases versatility in power supply options.

Maximum Operating Temperature: 70 °C

Can operate in high-temperature environments, making it suitable for industrial applications.

Output Range: 0.20-2.80V

Versatile output range allows for compatibility with different processing systems.

Output Type: DIGITAL VOLTAGE

Digital output simplifies interfacing with modern processing units and reduces noise.

Minimum Operating Temperature: -25 °C

Designed for extreme conditions, ensuring reliability in cold environments.

Maximum Operating Current: 30 mA

Low current usage contributes to longer battery life in portable applications.

Dynamic Range: 52 dB

A high dynamic range enhances performance in varied lighting conditions.

Vertical Pixel: 484

The high number of vertical pixels ensures clear and detailed vertical resolution.

Body Length/Diameter: 10.56 mm

Compact body length aids in system design and integration without increased footprint.

Termination Type: SOLDER

Solder termination ensures robust and secure connections for reliability.

Output Interface Type: I2C INTERFACE

I2C interface provides easy and efficient communication with microcontrollers.

Frame Rate: 30 fps

30 fps frame rate is sufficient for smooth video capture in most applications.

Array Type: FRAME TRANSFER

Frame transfer architecture reduces readout times and increases overall throughput.

Sensitivity: 2.05 V/lx.s

High sensitivity ensures excellent performance in low-light conditions.

Technical Specifications

Image Sensors VS6502V015 attributes and parameters. Explore more Image Sensors devices from STMicroelectronics

Specs

Array Type:

FRAME TRANSFER

Body Width:

8.66 inch

Body Height:

5.8 mm

Body Length/Diameter:

10.56 mm

Dynamic Range:

52 dB

Frame Rate:

30 fps

Horizontal Pixel:

644

Master Clock:

24 MHz

Maximum Operating Current:

30 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Output Interface Type:

I2C INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Power Supplies (V):

3.3

Sensitivity (V/lx.s):

2.05 V/lx.s

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.6 V

Termination Type:

SOLDER

Vertical Pixel:

484

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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