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VS6552V02C/T2

STMicroelectronics

VS6552V02C/T2 by STMicroelectronics

VS6552V02C/T2 by STMicroelectronics is a CMOS image sensor featuring a pixel size of 5.6x5.6 µm, operates at 3.3 V with a max temp of 70 °C, and supports I2C output at 30 fps. Ideal for imaging applications requiring high dynamic range (60 dB). Its compact design allows for versatile mounting options.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,219 parts In-Stock

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Anansix

USA . 2,287 parts In-Stock

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2,287

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Digiode

USA . 2,069 parts In-Stock

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2,069

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 564 parts In-Stock

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$1.790

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$1.611

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564

$1.790

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$1.611

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MKK Technologies

India . 687 parts In-Stock

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$3.367

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687

$3.367

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DigiPath Technology Company

USA . 687 parts In-Stock

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$3.367

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Corphita

USA . 4,817 parts In-Stock

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Parana Technologies

USA . 1,085 parts In-Stock

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$2.141

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1,085

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Overview

Unlock a new level of imaging excellence with the VS6552V02C/T2 image sensor from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers superior performance in diverse applications—from automotive systems to consumer electronics. Experience enhanced image clarity, low power consumption, and robust reliability, all designed to elevate your projects and reduce time-to-market. Elevate your technology with a partner you can trust!

Feature Benefit Bullets

Pixel Size: 5.6x5.6 µm

The small pixel size allows for high-resolution imaging, making this sensor suitable for applications requiring detailed images.

Maximum Supply Voltage: 3.3 V

Operating at a maximum supply voltage of 3.3 V facilitates compatibility with a wide range of electronic devices and reduces power consumption.

Master Clock: 26 MHz

A 26 MHz master clock ensures efficient data processing and quick response times, enhancing the overall performance of image capture.

Body Width: 8.5 inch

The compact size of the sensor allows for easy integration into various devices, maintaining a sleek design without sacrificing functionality.

Power Supplies: 3 V

The availability of three different power supplies provides flexibility in design and optimization for different usage scenarios.

Sensors/Transducers Type: IMAGE SENSOR, CMOS

CMOS technology offers advantages such as low power consumption and high-speed processing, making this sensor a cost-effective choice for image sensing.

Body Height: 6.1 mm

This low profile height allows for ease of integration into compact devices, making it versatile for various applications.

Package Shape or Style: RECTANGULAR

The rectangular package style allows for efficient space usage, making it easier to integrate into various PCB layouts.

Minimum Supply Voltage: 2.5 V

A minimum supply voltage of 2.5 V enables operation with lower power requirements, enhancing energy efficiency in device applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability and performance in a variety of environmental conditions.

Horizontal Pixel: 644

With 644 horizontal pixels, the sensor can capture detailed images, making it suitable for high-definition imaging applications.

Output Type: DIGITAL OUTPUT

Digital output allows for easier data processing and integration with modern electronic systems, simplifying system design.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature means the sensor can be used in a wider range of environments, making it ideal for outdoor applications.

Maximum Operating Current: 2 mA

With a maximum operating current of 2 mA, the sensor is energy-efficient, which is particularly important for battery-powered devices.

Dynamic Range: 60 dB

A dynamic range of 60 dB allows for capturing images in varying lighting conditions, ensuring clear and detailed visuals.

Vertical Pixel: 484

The vertical resolution of 484 pixels contributes to the overall capability for high-quality image capture, making it excellent for precision applications.

Body Length/Diameter: 14 mm

The compact dimensions allow for integration into small devices while maintaining robust performance characteristics.

Termination Type: SOLDER

Solder termination provides reliable electrical connections, essential for the stability and performance of electronic devices.

Output Interface Type: I2C INTERFACE

The I2C interface simplifies connections with microcontrollers and other devices, facilitating seamless integration.

Frame Rate: 30 fps

A frame rate of 30 fps offers smooth video capture and real-time imaging, ideal for dynamic applications.

Array Type: FRAME TRANSFER

Frame transfer technology enhances the speed of image capture and processing, making it suitable for high-speed applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides robustness and stability in device assembly, ensuring longevity and reliability.

Technical Specifications

Image Sensors VS6552V02C/T2 attributes and parameters. Explore more Image Sensors devices from STMicroelectronics

Specs

Array Type:

FRAME TRANSFER

Body Width:

8.5 inch

Body Height:

6.1 mm

Body Length/Diameter:

14 mm

Dynamic Range:

60 dB

Frame Rate:

30 fps

Horizontal Pixel:

644

Master Clock:

26 MHz

Mounting Feature:

Maximum Operating Current:

2 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Output Interface Type:

I2C INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Power Supplies (V):

3

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.5 V

Termination Type:

SOLDER

Vertical Pixel:

484

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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