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VS6552V015/T2

STMicroelectronics

VS6552V015/T2 by STMicroelectronics

VS6552V015/T2 by STMicroelectronics is a CMOS image sensor featuring a pixel size of 5.6x5.6 µm, operates at 3.3 V with a max temp of 70 °C, and supports I2C output at 30 fps. Ideal for imaging applications requiring high dynamic range and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,548 parts In-Stock

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3,548

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Anansix

USA . 2,280 parts In-Stock

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2,280

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Digiode

USA . 1,980 parts In-Stock

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1,980

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 633 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

$2.844

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633

$3.160

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$2.844

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MKK Technologies

India . 1,746 parts In-Stock

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$5.943

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1,746

$5.943

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DigiPath Technology Company

USA . 1,746 parts In-Stock

1+ parts

$5.943

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1,746

$5.943

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Corphita

USA . 2,974 parts In-Stock

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2,974

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Parana Technologies

USA . 745 parts In-Stock

1+ parts

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$3.778

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745

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$3.778

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Overview

Elevate your imaging applications with the VS6552V015/T2 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality CMOS image sensor delivers exceptional performance with a dynamic range of 60 dB and reliable operation across diverse conditions. Ideal for automotive, industrial, and consumer electronics, it ensures crisp, clear images at a competitive frame rate, empowering you to create cutting-edge products that stand out in the market. Experience unmatched reliability and support from a trusted manufacturer!

Feature Benefit Bullets

Pixel Size: 5.6x5.6 µm

The small pixel size allows for higher resolution in the captured images, making it suitable for applications requiring detailed imagery.

Maximum Supply Voltage: 3.3 V

Compatibility with standard supply voltages facilitates easier integration into existing systems.

Master Clock: 26 MHz

A higher master clock frequency allows for faster processing of image data, improving overall performance in dynamic environments.

Body Width: 8.5 inch

A compact body width contributes to size efficiency, making it easier to incorporate into space-constrained applications.

Power Supplies: 3 V

Low power supply requirement enhances energy efficiency, ideal for battery-operated devices.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

Use of CMOS technology provides advantages in terms of low power consumption and high-speed performance.

Body Height: 6.1 mm

Low height helps in minimizing the overall device profile, which is advantageous for design aesthetics and compact applications.

Package Shape or Style: RECTANGULAR

The rectangular package form is common and versatile, simplifying mounting and integration into various designs.

Minimum Supply Voltage: 2.5 V

The ability to operate at lower supply voltages expands adaptability in varied electronic systems.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable performance in harsh environments.

Horizontal Pixel: 644

A substantial number of horizontal pixels enables the capture of wide images with good detail.

Output Type: DIGITAL OUTPUT

The digital output simplifies interfacing with digital systems and enhances compatibility with modern devices.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature ensures reliable functioning in cold conditions.

Maximum Operating Current: 2 mA

Minimal operating current promotes energy efficiency, making it suitable for low-power applications.

Dynamic Range: 60 dB

A wide dynamic range allows for better performance in varying light conditions, improving image quality.

Vertical Pixel: 484

The combination of horizontal and vertical pixel counts delivers sufficient resolution for detailed image acquisition.

Body Length/Diameter: 14 mm

Compact body length enhances design flexibility for integration into various products.

Termination Type: SOLDER

Solder termination offers reliable connections, ensuring durability in various applications.

Output Interface Type: I2C INTERFACE

I2C interface facilitates easy communication with microcontrollers and sensors, simplifying system design.

Frame Rate: 30 fps

A frame rate of 30 fps enables smooth video capture, making it suitable for real-time applications.

Array Type: FRAME TRANSFER

Frame transfer architecture reduces smear and rolling shutter effects, enhancing image quality.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting aids in secure installation and is widely used in various PCB designs.

Technical Specifications

Image Sensors VS6552V015/T2 attributes and parameters. Explore more Image Sensors devices from STMicroelectronics

Specs

Array Type:

FRAME TRANSFER

Body Width:

8.5 inch

Body Height:

6.1 mm

Body Length/Diameter:

14 mm

Dynamic Range:

60 dB

Frame Rate:

30 fps

Horizontal Pixel:

644

Master Clock:

26 MHz

Mounting Feature:

Maximum Operating Current:

2 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Output Interface Type:

I2C INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Power Supplies (V):

3

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.5 V

Termination Type:

SOLDER

Vertical Pixel:

484

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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