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VND810SP13TR

STMicroelectronics

VND810SP13TR by STMicroelectronics

VND810SP13TR by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact design with 10 terminals and supports output currents up to 5A. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,148 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,148

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-

-

-

Digiode

USA . 3,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,001

-

-

-

-

Anansix

USA . 1,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,575

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,100 parts In-Stock

1+ parts

$8.022

100+ parts

-

1k+ parts

$7.220

10k+ parts

-

2,100

$8.022

-

$7.220

-

AZTECH Wire

Italy . 332 parts In-Stock

1+ parts

$12.580

100+ parts

-

1k+ parts

-

10k+ parts

-

332

$12.580

-

-

-

Microchip USA

USA . 378 parts In-Stock

1+ parts

$13.298

100+ parts

-

1k+ parts

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10k+ parts

-

378

$13.298

-

-

-

MKK Technologies

India . 2,339 parts In-Stock

1+ parts

$15.086

100+ parts

-

1k+ parts

-

10k+ parts

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2,339

$15.086

-

-

-

DigiPath Technology Company

USA . 2,339 parts In-Stock

1+ parts

$15.086

100+ parts

-

1k+ parts

-

10k+ parts

-

2,339

$15.086

-

-

-

Component Stockers USA

USA . 388 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

-

388

$99.990

-

-

-

Parana Technologies

USA . 2,054 parts In-Stock

1+ parts

-

100+ parts

$9.592

1k+ parts

-

10k+ parts

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2,054

-

$9.592

-

-

iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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900

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-

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Corphita

USA . 661 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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661

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Kepictronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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100

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-

-

Overview

Unlock unparalleled performance with the VND810SP13TR from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability, this advanced peripheral driver is perfect for automotive and industrial applications, offering robust built-in protections against transient spikes, overcurrent, and overheating. Its compact design fits seamlessly into your projects, ensuring safety and efficiency. Elevate your designs with ST’s trusted quality and experience unmatched value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction enhances the reliability and longevity of the product, making it suitable for various environmental conditions.

Surface Mount: YES

Being a surface mount device saves board space and allows for compact designs, which is essential in modern electronics.

Maximum Supply Voltage: 36 V

A high maximum supply voltage provides flexibility for different applications, accommodating a wide range of power requirements.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout efficiency, which is crucial for high-density circuit designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protection features enhance device safety and reliability, safeguarding against common electrical issues.

Power Supplies: 8/36 V

This wide voltage range allows the driver to operate in various systems and applications, offering versatility.

No. of Terminals: 10

With 10 terminals, the device provides multiple connections for complex configurations, supporting a range of circuit designs.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG

The small outline design with heat sink/slug capability ensures effective thermal management, which is critical in maintaining performance.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage increases compatibility with many low-power applications, enhancing its usability.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and reduces the risk of oxidation, contributing to a reliable connection.

Terminal Position: DUAL

Dual terminal position enables flexible layout options for designers, facilitating easier routing on circuit boards.

Maximum Seated Height: 3.75 mm

A low seated height allows the device to fit into tight spaces, making it ideal for compact designs.

Width: 7.5 mm

The moderate width is ideal for multi-terminal packages, ensuring efficient board space utilization.

Length: 9.4 mm

An optimal length provides a balance between space efficiency and connection capability.

Terminal Form: GULL WING

Gull-wing terminal form ensures stable solder joints and easier assembly, which improves manufacturing efficiency.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V optimally balances performance and power consumption in most peripheral applications.

Terminal Pitch: 1.27 mm

The standard terminal pitch enhances compatibility with common PCB layouts, making integration straightforward.

Driver No. of Bits: 2

A 2-bit driver configuration provides adequate control for various applications while simplifying the design process.

Nominal Output Peak Current Limit: 5 A

A peak current limit of 5 A ensures that the device can handle demanding loads, increasing its usability in high-performance scenarios.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based design makes this driver versatile for different control requirements, enhancing its applicability.

Output Current Flow Direction: SINK

The ability to sink current allows for effective control in various applications, giving flexibility in circuit design.

Technical Specifications

Peripheral Drivers VND810SP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VND810SP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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