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VND810SP-E

STMicroelectronics

VND810SP-E by STMicroelectronics

VND810SP-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and supports up to 3.5A output current. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,606 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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7,606

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-

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Anansix

USA . 2,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,081

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Digiode

USA . 1,108 parts In-Stock

1+ parts

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100+ parts

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1,108

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,421 parts In-Stock

1+ parts

$5.041

100+ parts

-

1k+ parts

$4.537

10k+ parts

-

1,421

$5.041

-

$4.537

-

MKK Technologies

India . 1,457 parts In-Stock

1+ parts

$9.479

100+ parts

-

1k+ parts

-

10k+ parts

-

1,457

$9.479

-

-

-

DigiPath Technology Company

USA . 1,457 parts In-Stock

1+ parts

$9.479

100+ parts

-

1k+ parts

-

10k+ parts

-

1,457

$9.479

-

-

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$11.681

100+ parts

$10.630

1k+ parts

$9.578

10k+ parts

-

600

$11.681

$10.630

$9.578

-

Microchip USA

USA . 138 parts In-Stock

1+ parts

$13.988

100+ parts

-

1k+ parts

-

10k+ parts

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138

$13.988

-

-

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AZTECH Wire

Italy . 1,020 parts In-Stock

1+ parts

$14.080

100+ parts

-

1k+ parts

-

10k+ parts

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1,020

$14.080

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Corphita

USA . 3,089 parts In-Stock

1+ parts

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100+ parts

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3,089

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Perfect Parts

USA . 2,708 parts In-Stock

1+ parts

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2,708

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-

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Parana Technologies

USA . 1,854 parts In-Stock

1+ parts

-

100+ parts

$6.027

1k+ parts

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10k+ parts

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1,854

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$6.027

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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100+ parts

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350

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Overview

Unlock unparalleled performance with the VND810SP-E from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This powerful peripheral driver seamlessly combines reliability and efficiency, making it ideal for automotive and industrial applications. With built-in protections against overcurrent, overvoltage, and thermal risks, enjoy peace of mind while boosting your project's capabilities. Elevate your designs with superior quality and unmatched support from STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protects the internal components, making this peripheral driver reliable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient thermal management, making the product suitable for modern electronic devices.

Maximum Supply Voltage: 36 V

A high maximum supply voltage ensures compatibility with a wide range of applications and power requirements.

No. of Functions: 2

Multiple functions in a single device reduce component count, saving space and cost in circuit designs.

Package Shape: RECTANGULAR

The rectangular shape enables optimal layout design in PCB applications, contributing to design flexibility.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance the robustness and reliability of the device, preventing damage under various conditions.

Power Supplies (V): 8/36

Supports a range of supply voltages, providing greater versatility for different circuit designs.

No. of Terminals: 10

Ten terminals allow for versatile connectivity options, making it easy to integrate into varied designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline style helps save space on PCBs while the heat sink/slug option supports better thermal management.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage ensures compatibility with lower voltage applications, broadening use cases.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing reliability over time.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible routing options on the PCB for easier integration.

Maximum Seated Height: 3.75 mm

A low seated height minimizes profile and footprint, allowing for space-efficient designs.

Width: 7.5 mm

A compact width allows for higher density designs in limited spaces.

Maximum Time At Peak Reflow Temperature (s): 30

Extended peak reflow time supports a wide range of PCB assembly processes without damaging components.

Peak Reflow Temperature °C: 250

Supports high-temperature soldering processes, ensuring compatibility with contemporary PCBs.

Length: 9.4 mm

A compact length supports dense assembly, catering to compact electronic devices.

Maximum Output Current: 3.5 A

A high output current capability enables driving a wide range of peripherals effectively.

Terminal Form: GULL WING

Gull wing terminal form provides excellent mechanical strength and ease of soldering.

Nominal Supply Voltage: 13 V

Operational at a nominal supply voltage that aligns well with many standard power supply designs.

Terminal Pitch: 1.27 mm

The narrow terminal pitch allows for compact component placement, improving PCB layout efficiency.

Driver No. of Bits: 2

Two bits of driver capability make it suitable for simple control applications, allowing efficient use of resources.

Moisture Sensitivity Level (MSL): 3

Mid-level moisture sensitivity indicates good handling characteristics for PCB assembly processes.

Nominal Output Peak Current Limit: 5 A

The peak current limit supports robust output performance, accommodating high-demand applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter, it meets a variety of interfacing needs in peripheral driver applications.

Output Current Flow Direction: SOURCE

The source current flow direction is ideal for driving loads, ensuring efficient operation of connected devices.

Technical Specifications

Peripheral Drivers VND810SP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

3.5 A

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND810SP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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