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VND830SP13TR

STMicroelectronics

VND830SP13TR by STMicroelectronics

VND830SP13TR by STMicroelectronics is a peripheral driver with 10 terminals, operating voltage of 5.5-36 V, and output current limit of 9 A. Ideal for automotive applications, it offers built-in protections against transient, over current, and over voltage conditions. With a compact design and sink flow direction, it ensures reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,332 parts In-Stock

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4,332

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Digiode

USA . 3,542 parts In-Stock

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3,542

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Anansix

USA . 2,181 parts In-Stock

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2,181

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Chip Stock

USA . 402 parts In-Stock

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402

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,298 parts In-Stock

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$3.306

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-

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$2.975

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1,298

$3.306

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$2.975

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Corohmni

South Africa . 98 parts In-Stock

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$5.530

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98

$5.530

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MKK Technologies

India . 1,514 parts In-Stock

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$6.216

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1,514

$6.216

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DigiPath Technology Company

USA . 1,514 parts In-Stock

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$6.216

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1,514

$6.216

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Ampacity Inc.

Singapore . 1,144 parts In-Stock

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$6.500

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1,144

$6.500

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AZTECH Wire

Italy . 819 parts In-Stock

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$9.122

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819

$9.122

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Aztec Data Supply Inc.

USA . 1,439 parts In-Stock

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$13.190

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1,439

$13.190

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Semicontronic

India . 901 parts In-Stock

1+ parts

$23.500

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$22.912

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$22.795

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901

$23.500

$22.912

$22.795

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Microchip USA

USA . 469 parts In-Stock

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$27.249

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469

$27.249

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RC Electronics

USA . 35,646 parts In-Stock

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Kepictronics

USA . 9,600 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,710 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,161 parts In-Stock

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Lixinc

USA . 3,597 parts In-Stock

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Corphita

USA . 2,117 parts In-Stock

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Advanced Electronics

New Zealand . 1,612 parts In-Stock

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Continental Prestige Electronics

USA . 1,403 parts In-Stock

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Perfect Parts

USA . 1,254 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Metaverse IC Inc.

Canada . 600 parts In-Stock

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600

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Argo Parts USA

USA . 478 parts In-Stock

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478

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Parana Technologies

USA . 366 parts In-Stock

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$3.952

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366

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unleash the power of your automotive applications with the VND830SP13TR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality peripheral drivers that offer unparalleled protection against transient, over current, over voltage, thermal, and under voltage issues. With a supply voltage range from 5.5V to 36V and a peak output current limit of 9A, this small outline, heat sink package provides customers with a reliable and efficient solution for their driving needs. Upgrade your automotive electronics today with the VND830SP13TR and experience the difference in performance and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the packaging makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and facilitating mass production.

Maximum Supply Voltage: 36 V

Supports a wide range of supply voltages, making it versatile for use in different systems and environments.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of the product, protecting it from various electrical faults and ensuring longevity.

Minimum Supply Voltage: 5.5 V

With a low minimum supply voltage, the product can operate efficiently even in low-power situations, making it energy-efficient.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring the product can withstand the challenging temperature conditions and vibrations commonly found in vehicles.

Technical Specifications

Peripheral Drivers VND830SP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND830SP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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