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VND810PEP-E

STMicroelectronics

VND810PEP-E by STMicroelectronics

VND810PEP-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent and thermal issues. It features a compact design (4.9mm x 3.9mm) suitable for space-constrained applications. Ideal for automotive and industrial uses, it supports output currents up to 5A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,552

-

-

-

-

Vyrian

USA . 4,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,132

-

-

-

-

Anansix

USA . 812 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

812

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 486 parts In-Stock

1+ parts

$8.500

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$8.500

-

-

-

IDEA Electronic Components Group

UK . 1,119 parts In-Stock

1+ parts

$9.206

100+ parts

-

1k+ parts

$8.285

10k+ parts

-

1,119

$9.206

-

$8.285

-

AZTECH Wire

Italy . 705 parts In-Stock

1+ parts

$15.730

100+ parts

-

1k+ parts

-

10k+ parts

-

705

$15.730

-

-

-

MKK Technologies

India . 614 parts In-Stock

1+ parts

$17.310

100+ parts

-

1k+ parts

-

10k+ parts

-

614

$17.310

-

-

-

DigiPath Technology Company

USA . 614 parts In-Stock

1+ parts

$17.310

100+ parts

-

1k+ parts

-

10k+ parts

-

614

$17.310

-

-

-

Microchip USA

USA . 485 parts In-Stock

1+ parts

$26.685

100+ parts

-

1k+ parts

-

10k+ parts

-

485

$26.685

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-

-

Corphita

USA . 4,590 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,590

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-

-

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Perfect Parts

USA . 2,352 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,352

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-

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Parana Technologies

USA . 1,602 parts In-Stock

1+ parts

-

100+ parts

$11.007

1k+ parts

-

10k+ parts

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1,602

-

$11.007

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-

Overview

Unlock unparalleled performance with the VND810PEP-E from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility and reliability, this advanced peripheral driver boasts built-in protections to safeguard your applications, ensuring longevity and peace of mind. Perfect for automotive and industrial uses, it excels in delivering robust power management and efficiency, making it the ideal choice for those who demand quality and excellence in every project. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers durability and resistance to environmental factors, making the product suitable for varied conditions.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on circuit boards.

Maximum Supply Voltage: 36 V

A high maximum supply voltage makes this driver versatile for various applications requiring different voltage levels.

No. of Functions: 2

Having two functions allows for simplified designs and integration into systems, enhancing functionality.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient, allowing for better layout in compact devices.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The multiple built-in protections ensure safety and longevity of the device, safeguarding against common electrical issues.

Power Supplies (V): 8/36

Support for a wide range of power supply voltages (8V to 36V) provides flexibility for different applications.

No. of Terminals: 12

A total of 12 terminals allows for varied connectivity options, enhancing its adaptability in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

The low profile design contributes to space savings and heat dissipation, ideal for compact electronic designs.

Minimum Supply Voltage: 5.5 V

The minimum supply voltage requirement of 5.5V makes it usable in low-power applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for easier integration into PCB layouts and improved performance.

Maximum Seated Height: 1.62 mm

A low seated height facilitates easier stacking of components and maintains a compact design footprint.

Width: 3.9 mm

A narrow width supports space-constrained designs, ensuring compatibility in tight layouts.

Length: 4.9 mm

Compact length enhances design flexibility, enabling its use in a wide range of applications.

Terminal Form: GULL WING

Gull wing terminals allow for easy inspection and soldering, improving manufacturing efficiency.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V balances performance and efficiency, suitable for most applications.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for denser component placement, leading to more compact and efficient circuit designs.

Driver No. of Bits: 2

With 2 bits, this driver can efficiently control digital signals, making it ideal for various logic applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity, allowing for standard handling and storage practices, while ensuring reliability.

Nominal Output Peak Current Limit: 5 A

The capability to handle a peak output current of 5 A offers high power performance for driving loads effectively.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This classification indicates versatility in use as both a buffer and inverter, catering to diverse design needs.

Output Current Flow Direction: SOURCE

The source current flow direction enhances compatibility with various peripheral drivers and devices.

Technical Specifications

Peripheral Drivers VND810PEP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

12

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

VND810PEP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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