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VND830ETR-E

STMicroelectronics

VND830ETR-E by STMicroelectronics

VND830ETR-E by STMicroelectronics is a peripheral driver with a max supply voltage of 36V. It has built-in protections for transient, over voltage, thermal, and under voltage conditions. This small outline package is commonly used as a buffer or inverter based peripheral driver in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,011 parts In-Stock

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8,011

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Digiode

USA . 1,732 parts In-Stock

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1,732

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Anansix

USA . 674 parts In-Stock

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674

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Andel Nordic

Denmark . 3,055 parts In-Stock

1+ parts

$3.572

100+ parts

-

1k+ parts

$3.429

10k+ parts

$3.429

3,055

$3.572

-

$3.429

$3.429

Corohmni

South Africa . 483 parts In-Stock

1+ parts

$4.902

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483

$4.902

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IDEA Electronic Components Group

UK . 2,003 parts In-Stock

1+ parts

$11.966

100+ parts

-

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$10.770

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2,003

$11.966

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$10.770

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Aztec Data Supply Inc.

USA . 159 parts In-Stock

1+ parts

$14.110

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159

$14.110

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AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$15.900

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460

$15.900

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Ampacity Inc.

Singapore . 991 parts In-Stock

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$18.500

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991

$18.500

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MKK Technologies

India . 1,125 parts In-Stock

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$22.502

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$22.502

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DigiPath Technology Company

USA . 1,125 parts In-Stock

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$22.502

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$22.502

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Microchip USA

USA . 379 parts In-Stock

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$51.014

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379

$51.014

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Lixinc

USA . 16,094 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,895 parts In-Stock

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Corphita

USA . 4,065 parts In-Stock

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Continental Prestige Electronics

USA . 3,330 parts In-Stock

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3,330

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 1,914 parts In-Stock

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Futuretech Components

Singapore . 1,100 parts In-Stock

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1,100

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RC Electronics

USA . 1,000 parts In-Stock

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1,000

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Parana Technologies

USA . 375 parts In-Stock

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$14.308

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375

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$14.308

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Overview

The VND830ETR-E by STMicroelectronics is a top-quality peripheral driver that offers unmatched performance and reliability. As a renowned manufacturer, STMicroelectronics has a track record of delivering exceptional products. This compact device is perfect for a wide range of applications, thanks to its built-in protections against transient, over voltage, thermal, and under voltage events. With a supply voltage range of 5.5V to 36V, it provides flexibility while ensuring optimum functionality. Designed with customer satisfaction in mind, the VND830ETR-E delivers value, benefits, and advantages that are second to none. Experience seamless operation and enhanced efficiency with this remarkable peripheral driver.

Feature Benefit Bullets

Surface Mount: YES

With surface mount capability, this peripheral driver can be easily and securely mounted onto circuit boards, providing convenience in the manufacturing process.

Maximum Supply Voltage: 36 V

The high maximum supply voltage enables this peripheral driver to handle a wide range of power supply requirements, making it versatile and adaptable to different systems.

No. of Functions: 1

With a single function, this peripheral driver simplifies the circuit design, reducing complexity and enhancing overall system efficiency.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space, making it ideal for applications with limited board space or compact designs.

Built-in Protections: TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

This peripheral driver offers comprehensive built-in protection features, ensuring the safety and reliability of the connected devices in the event of various faults or operating conditions.

Power Supplies (V): 8/36

This peripheral driver supports power supplies ranging from 8 V to 36 V, providing compatibility with a wide range of power sources and simplifying system integration.

No. of Terminals: 16

With 16 terminals, this peripheral driver offers multiple connection options, allowing for flexible and versatile integration into the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact form factor, facilitating space-efficient board layout and enabling integration in applications with limited space.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage requirement ensures compatibility with lower voltage power sources, expanding the range of applications where this peripheral driver can be used.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish provides excellent conductivity and resistance to corrosion, ensuring reliable electrical connections over time.

Terminal Position: DUAL

The dual terminal position enables easy and efficient PCB mounting, enhancing manufacturing efficiency and reducing assembly time.

Maximum Seated Height: 2.65 mm

With a low maximum seated height, this peripheral driver takes up minimal vertical space, making it suitable for applications with height limitations.

Width: 7.5 mm

The compact width of this peripheral driver makes it compatible with narrow spaces, contributing to space-efficient circuit board designs.

Maximum Time At Peak Reflow Temperature (s): 30

The peripheral driver can withstand the peak reflow temperature for up to 30 seconds, ensuring proper soldering during the assembly process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this peripheral driver can withstand the high temperatures typically encountered during the soldering process, ensuring reliable performance.

Length: 10.3 mm

The moderate length of this peripheral driver allows for easy integration into various system designs, providing flexibility and adaptability.

Terminal Form: GULL WING

The gull wing terminal form facilitates secure and reliable soldering connections, ensuring robust mechanical and electrical integrity.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V provides a standard operating voltage for this peripheral driver, making it compatible with many common power supply configurations.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise and convenient connections, reducing the risk of signal interference and improving overall system performance.

Driver No. of Bits: 2

With two bits, this peripheral driver is capable of driving and controlling binary digital signals, providing a reliable and efficient interface for various applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level 3 designation ensures that this peripheral driver can withstand exposure to moisture during storage and reflow processes, maintaining its performance and reliability.

Nominal Output Peak Current Limit: 13.5 A

The nominal output peak current limit of 13.5 A allows this peripheral driver to handle high current requirements, making it suitable for driving power-hungry devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This peripheral driver features a buffer or inverter interface IC type, providing flexibility and compatibility with different signal requirements.

Output Current Flow Direction: SINK

The output current flow direction being "sink" indicates that this peripheral driver is designed to supply current to external devices, making it suitable for applications where the sinking of current is required.

Technical Specifications

Peripheral Drivers VND830ETR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

13.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND830ETR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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