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VND810P-E

STMicroelectronics

VND810P-E by STMicroelectronics

VND810P-E by STMicroelectronics is a 16-terminal peripheral driver with 1A output current, suitable for sink applications. It operates on power supplies ranging from 8V to 36V and has a peak output current limit of 5A. The small outline package style makes it ideal for compact designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 5,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,588

-

-

-

-

Digiode

USA . 2,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,985

-

-

-

-

Vyrian

USA . 1,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,229

-

-

-

-

Anansix

USA . 265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

265

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,584 parts In-Stock

1+ parts

$3.184

100+ parts

-

1k+ parts

$2.866

10k+ parts

-

1,584

$3.184

-

$2.866

-

MKK Technologies

India . 745 parts In-Stock

1+ parts

$5.988

100+ parts

-

1k+ parts

-

10k+ parts

-

745

$5.988

-

-

-

DigiPath Technology Company

USA . 745 parts In-Stock

1+ parts

$5.988

100+ parts

-

1k+ parts

-

10k+ parts

-

745

$5.988

-

-

-

Corphita

USA . 4,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,788

-

-

-

-

Assy Fe

Spain . 4,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,740

-

-

-

-

Perfect Parts

USA . 2,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,688

-

-

-

-

Parana Technologies

USA . 257 parts In-Stock

1+ parts

-

100+ parts

$3.807

1k+ parts

-

10k+ parts

-

257

-

$3.807

-

-

Overview

Unlock the power of your devices with the VND810P-E by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers high-quality peripheral drivers that are designed to enhance the performance and efficiency of your applications. With a wide range of uses and a compact package style, this product offers exceptional value to customers seeking reliable and versatile solutions. Experience the benefits of seamless integration and improved output current flow direction with the VND810P-E. Elevate your projects with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the driver, ensuring a long lifespan.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving assembly time.

Power Supplies (V): 8/36

Compatible with a wide range of power supplies, increasing versatility.

No. of Terminals: 16

Sufficient terminals for connecting to various components in a system.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the PCB and allows for dense component placement.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures reliable electrical connections with good conductivity and corrosion resistance.

Terminal Position: DUAL

Provides flexibility in installation orientation and layout.

Maximum Output Current: 1 A

Capable of driving components with moderate power requirements.

Terminal Pitch: 1.27 mm

Standard pitch for easy integration into PCB layouts.

Driver No. of Bits: 2

Suitable for driving components with binary control inputs.

Moisture Sensitivity Level (MSL): 3

Can withstand moderate levels of moisture exposure during storage and handling.

Nominal Output Peak Current Limit: 5 A

Capability to drive components requiring higher peak currents for short durations.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Provides signal buffering or inversion capabilities for interfacing with different types of components.

Output Current Flow Direction: SINK

Designed to sink current, suitable for driving components with a common cathode connection.

Technical Specifications

Peripheral Drivers VND810P-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Output Current Flow Direction:

SINK

Maximum Output Current:

1 A

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

VND810P-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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