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VND830ASP-E

STMicroelectronics

VND830ASP-E by STMicroelectronics

VND830ASP-E by STMicroelectronics is a 2A peripheral driver with 10 terminals, suitable for sink output current flow direction. It operates on power supplies ranging from 8V to 36V and has a max peak reflow temperature of 250°C. This small outline package driver is ideal for buffer or inverter-based interface IC applications.

Median Price

$1.706

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 800 parts In-Stock

1+ parts

$1.706

100+ parts

-

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800

$1.706

-

-

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Vyrian

USA . 8,938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,938

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Digiode

USA . 4,219 parts In-Stock

1+ parts

-

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4,219

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-

-

-

Anansix

USA . 1,195 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,195

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 439 parts In-Stock

1+ parts

$1.706

100+ parts

-

1k+ parts

-

10k+ parts

$1.672

439

$1.706

-

-

$1.672

Argo Parts USA

USA . 247 parts In-Stock

1+ parts

$1.706

100+ parts

-

1k+ parts

-

10k+ parts

-

247

$1.706

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$1.706

100+ parts

-

1k+ parts

$1.621

10k+ parts

$1.587

50

$1.706

-

$1.621

$1.587

Corohmni

South Africa . 1,229 parts In-Stock

1+ parts

$4.067

100+ parts

-

1k+ parts

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10k+ parts

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1,229

$4.067

-

-

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Aztec Data Supply Inc.

USA . 683 parts In-Stock

1+ parts

$4.880

100+ parts

-

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683

$4.880

-

-

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AZTECH Wire

Italy . 403 parts In-Stock

1+ parts

$9.303

100+ parts

-

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403

$9.303

-

-

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IDEA Electronic Components Group

UK . 620 parts In-Stock

1+ parts

$12.706

100+ parts

-

1k+ parts

$11.436

10k+ parts

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620

$12.706

-

$11.436

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Microchip USA

USA . 1,190 parts In-Stock

1+ parts

$16.178

100+ parts

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1,190

$16.178

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MKK Technologies

India . 2,101 parts In-Stock

1+ parts

$23.893

100+ parts

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2,101

$23.893

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DigiPath Technology Company

USA . 2,101 parts In-Stock

1+ parts

$23.893

100+ parts

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2,101

$23.893

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Ampacity Inc.

Singapore . 1,284 parts In-Stock

1+ parts

$28.500

100+ parts

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1,284

$28.500

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Component Stockers USA

USA . 225 parts In-Stock

1+ parts

$99.990

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225

$99.990

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Perfect Parts

USA . 3,968 parts In-Stock

1+ parts

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3,968

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Parana Technologies

USA . 1,106 parts In-Stock

1+ parts

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100+ parts

$15.192

1k+ parts

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10k+ parts

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1,106

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$15.192

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Corphita

USA . 316 parts In-Stock

1+ parts

-

100+ parts

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316

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Overview

The VND830ASP-E by STMicroelectronics is a top-of-the-line peripheral driver designed to provide superior performance and reliability. With a wide range of applications, this product is perfect for various electronic devices. STMicroelectronics, known for their high-quality components, ensures that the VND830ASP-E delivers exceptional value and benefits to customers. Experience the advantages of this cutting-edge technology and enhance your products with the reliability and performance that STMicroelectronics is renowned for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the peripheral driver, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Power Supplies (V): 8/36

The wide range of power supplies supported (8V to 36V) allows this driver to be compatible with a variety of systems and devices.

No. of Terminals: 10

Having 10 terminals provides flexibility in connectivity options and allows for versatility in designing circuits.

Terminal Finish: MATTE TIN

The matte tin finish on terminals ensures good electrical conductivity and reliability in signal transmission.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance of 250°C ensures that the peripheral driver can withstand demanding soldering processes.

Maximum Output Current: 2 A

With a maximum output current of 2A, this peripheral driver is capable of driving a variety of components and devices effectively.

Driver No. of Bits: 2

Having 2 bits for the driver allows for efficient control and manipulation of signals, enhancing the performance of the peripheral driver.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The flexibility of having a buffer or inverter based interface IC type provides compatibility with different signal types and systems.

Output Current Flow Direction: SINK

The sink output current flow direction allows for easy interfacing with components that require a sinking current, making this driver versatile in various applications.

Technical Specifications

Peripheral Drivers VND830ASP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

10

Output Current Flow Direction:

SINK

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VND830ASP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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