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VND83013TR

STMicroelectronics

VND83013TR by STMicroelectronics

VND83013TR by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and supports output currents up to 9A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Sensible Micro Corp

USA . 12,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12,733

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-

-

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Vyrian

USA . 6,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,110

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-

-

-

ComSIT Distribution GmbH

Germany . 2,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,115

-

-

-

-

ComSIT USA

USA . 2,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,115

-

-

-

-

Digiode

USA . 1,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,760

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-

-

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Anansix

USA . 1,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,229

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 321 parts In-Stock

1+ parts

$3.566

100+ parts

-

1k+ parts

$3.209

10k+ parts

-

321

$3.566

-

$3.209

-

MKK Technologies

India . 2,200 parts In-Stock

1+ parts

$6.705

100+ parts

-

1k+ parts

-

10k+ parts

-

2,200

$6.705

-

-

-

DigiPath Technology Company

USA . 2,200 parts In-Stock

1+ parts

$6.705

100+ parts

-

1k+ parts

-

10k+ parts

-

2,200

$6.705

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$9.659

100+ parts

$8.790

1k+ parts

$7.920

10k+ parts

-

200

$9.659

$8.790

$7.920

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AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$11.330

100+ parts

-

1k+ parts

-

10k+ parts

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638

$11.330

-

-

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Microchip USA

USA . 110 parts In-Stock

1+ parts

$12.062

100+ parts

-

1k+ parts

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10k+ parts

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110

$12.062

-

-

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A-Z Elektronik GmbH

Germany . 7,032 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,032

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-

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iodParts Technologies Inc.

India . 2,430 parts In-Stock

1+ parts

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2,430

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-

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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-

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Corphita

USA . 1,815 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,815

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Parana Technologies

USA . 128 parts In-Stock

1+ parts

-

100+ parts

$4.264

1k+ parts

-

10k+ parts

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128

-

$4.264

-

-

Overview

Experience unmatched reliability with the VND83013TR by STMicroelectronics, a leading name in innovation. This advanced peripheral driver combines robust built-in protections, ensuring your applications run smoothly under any conditions. With its compact design and high-efficiency performance, it’s perfect for automotive and industrial uses, delivering exceptional value. Trust STMicroelectronics for quality that empowers your designs and enhances operational efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and protects against environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for modern electronic devices with limited space.

Maximum Supply Voltage: 36 V

A high maximum supply voltage provides versatility for various applications, accommodating different voltage requirements.

Package Shape: RECTANGULAR

The rectangular shape is ideal for space-saving layouts and efficient PCB (Printed Circuit Board) designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance reliability, ensuring safe operation in fluctuating conditions and preventing damage.

Power Supplies (V): 8/36

Flexible power supply options range from 8V to 36V, making it adaptable to various project requirements.

No. of Terminals: 16

Having 16 terminals offers multiple connection possibilities, facilitating complex circuits and features.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in saving space on PCBs while allowing for easy integration into compact designs.

Minimum Supply Voltage: 5.5 V

A relatively low minimum supply voltage makes this product suitable for low-voltage applications, enhancing its usability.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible connectivity options, making installation and circuit layout easier.

Maximum Seated Height: 2.65 mm

A low seated height helps in minimizing the overall height of the assembled device, supporting slim designs.

Width: 7.5 mm

A narrow width of 7.5 mm is conducive to high-density board layouts, providing designers more options without sacrificing space.

Length: 10.3 mm

The length of 10.3 mm is optimized for compact designs, ensuring it fits seamlessly into modern electronic devices.

Maximum Output Current: 6 A

The capacity to handle up to 6 A ensures that this peripheral driver can power a variety of demanding applications.

Technology: MOS

Utilizing MOS technology enhances efficiency and speed, making it ideal for high-performance applications.

Terminal Form: GULL WING

Gull wing terminal form enhances the ease of soldering, leading to improved manufacturing processes and assembly.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13V strikes a balance between performance and power efficiency, ensuring stable operation.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard in many applications, simplifying PCB design and manufacturing.

Driver No. of Bits: 2

Having 2 bits allows for control of multiple functions, enhancing flexibility in peripheral device management.

Nominal Output Peak Current Limit: 9 A

The ability to handle up to 9 A peak output current ensures that the product can meet high transient loads efficiently.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter-based driver, it provides reliable signal integrity, making it suitable for diverse applications.

Output Current Flow Direction: SINK

The sink output current direction allows for effective control of load activation, enhancing device performance.

Technical Specifications

Peripheral Drivers VND83013TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SINK

Maximum Output Current:

6 A

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VND83013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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