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VND810TR-E

STMicroelectronics

VND810TR-E by STMicroelectronics

VND810TR-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and output current up to 5A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,105 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,105

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Digiode

USA . 2,338 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,338

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Anansix

USA . 1,907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,907

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 405 parts In-Stock

1+ parts

$4.850

100+ parts

-

1k+ parts

$4.365

10k+ parts

-

405

$4.850

-

$4.365

-

MKK Technologies

India . 1,164 parts In-Stock

1+ parts

$9.121

100+ parts

-

1k+ parts

-

10k+ parts

-

1,164

$9.121

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-

-

DigiPath Technology Company

USA . 1,164 parts In-Stock

1+ parts

$9.121

100+ parts

-

1k+ parts

-

10k+ parts

-

1,164

$9.121

-

-

-

AZTECH Wire

Italy . 196 parts In-Stock

1+ parts

$21.210

100+ parts

-

1k+ parts

-

10k+ parts

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196

$21.210

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-

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Microchip USA

USA . 394 parts In-Stock

1+ parts

$27.977

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$27.977

-

-

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A-Z Elektronik GmbH

Germany . 1,725 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,725

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-

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iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

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100+ parts

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900

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Corphita

USA . 406 parts In-Stock

1+ parts

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406

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Parana Technologies

USA . 310 parts In-Stock

1+ parts

-

100+ parts

$5.799

1k+ parts

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10k+ parts

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310

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$5.799

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-

Overview

Unlock the potential of your designs with the VND810TR-E from STMicroelectronics—a leading name in high-quality semiconductor solutions. This versatile peripheral driver combines robust protection features and superior performance, making it ideal for automotive, industrial, and consumer applications. With its compact design, reliable operation, and ease of integration, the VND810TR-E ensures efficient power management and longevity, delivering unmatched value to your projects. Elevate your innovation with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy enhances the product's reliability and longevity in various environments.

Surface Mount: YES

Surface mount capability facilitates compact PCB designs and allows for automated assembly, improving production efficiency.

Maximum Supply Voltage: 36 V

The capability to handle a maximum supply voltage of 36 V offers flexibility for various applications requiring higher voltage levels.

No. of Functions: 2

Having two functions effectively maximizes utility while minimizing space on the PCB, leading to a more efficient design.

Package Shape: RECTANGULAR

The rectangular package shape allows for space-efficient placement on PCBs, optimizing layout and component density.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Robust built-in protections ensure reliability and safety, safeguarding the device from various electrical faults and environmental conditions.

Power Supplies (V): 8/36

Versatile power supply range of 8 to 36 V makes this product suitable for diverse applications across multiple industries.

No. of Terminals: 16

With 16 terminals, this driver offers ample connectivity for complex circuits, enabling versatile usage in peripheral applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, helping designers maintain a compact form factor.

Minimum Supply Voltage: 5.5 V

The ability to operate at a minimum supply voltage of 5.5 V enhances compatibility with low-power systems while maintaining performance.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring lasting performance.

Terminal Position: DUAL

Dual terminal positioning can simplify PCB layout and enhance connection options, improving design flexibility.

Maximum Seated Height: 1.75 mm

A low maximum seated height of 1.75 mm is beneficial for designs with height restrictions, contributing to a sleeker overall design.

Width: 3.9 mm

A compact width of 3.9 mm allows for denser arrangements of components, vital for modern electronics where space is at a premium.

Maximum Time At Peak Reflow Temperature (s): 30

Support for a maximum time of 30 seconds at peak reflow temperature simplifies the soldering process during assembly.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of 260 °C ensures compatibility with standard surface mount soldering processes.

Length: 9.9 mm

A length of 9.9 mm contributes to compact design layouts, making the product suitable for tight-fitting circuits.

Maximum Output Current: 3.5 A

The ability to provide up to 3.5 A output current allows the driver to power various peripheral devices effectively.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and visual inspection, facilitating reliable assembly and maintenance.

Nominal Supply Voltage: 13 V

Designed with a nominal supply voltage of 13 V, the product provides stable performance across a range of operating conditions.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch maximizes space utilization while ensuring ease of soldering and assembly.

Driver No. of Bits: 2

A two-bit driver configuration allows for versatile control of peripheral devices, enhancing functionality.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate susceptibility to humidity, allowing for proper handling and storage practices.

Nominal Output Peak Current Limit: 5 A

A high nominal output peak current limit of 5 A enables effective drive of high-demand peripherals without performance degradation.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed as a buffer or inverter based peripheral driver, this IC offers robust signal integrity for peripheral connections.

Output Current Flow Direction: SOURCE

As a source output current driver, it simplifies design requirements for powering peripheral devices.

Technical Specifications

Peripheral Drivers VND810TR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Maximum Output Current:

3.5 A

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

VND810TR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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