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BTS712N1

Infineon Technologies

BTS712N1 by Infineon Technologies

BTS712N1 by Infineon Technologies is a MOS peripheral driver with 20 terminals, offering built-in protections for transient, over current, and over voltage. It operates at supply voltages of 5-34 V and has a max output current of 1.7 A. Ideal for automotive applications due to AEC-Q100 screening level and small outline package style.

Median Price

$6.220

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 15,368 parts In-Stock

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$6.220

100+ parts

$4.080

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$3.460

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$3.450

15,368

$6.220

$4.080

$3.460

$3.450

Distributors (In-Stock)

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Digiode

USA . 298 parts In-Stock

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$5.766

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Maritex

Poland . 17,000 parts In-Stock

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Vyrian

USA . 30,576 parts In-Stock

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Huijzer Components

Netherlands . 4,969 parts In-Stock

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VNN

France . 2,045 parts In-Stock

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Zilex Electronics Inc.

Canada . 1,216 parts In-Stock

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Rutronik

Germany . 1,000 parts In-Stock

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

France . 346 parts In-Stock

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Holdelec - ElecDif-Pro

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LIBRA Elektronik GmbH

Germany . 343 parts In-Stock

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A&K Electronics

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Bristol Electronics

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Nova Conductors

Japan . 44 parts In-Stock

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Standard Data Resources

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J & M Industries LLC

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LittleDiode

UK . 9 parts In-Stock

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Ampacity Inc.

Singapore . 30,359 parts In-Stock

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$5.160

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Semicontronic

India . 30,315 parts In-Stock

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$5.160

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$5.031

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$5.005

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$5.160

$5.031

$5.005

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Corphita

USA . 49 parts In-Stock

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$5.463

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Aztec Data Supply Inc.

USA . 4,058 parts In-Stock

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$7.289

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Modulus Dynamics

Lithuania . 892 parts In-Stock

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$13.144

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$12.618

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$12.092

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Corohmni

South Africa . 231 parts In-Stock

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Lixinc

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Perfect Parts

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Metaverse IC Inc.

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,813 parts In-Stock

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Alle Elektronik GmbH

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Assy Fe

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Continental Prestige Electronics

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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Glotronic Ltd.

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Kepictronics

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Argo Parts USA

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

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Overview

Elevate your electronics projects with the BTS712N1 by Infineon Technologies. This peripheral driver offers unparalleled quality and reliability, thanks to its built-in protections against transient events, over-current, over-voltage, thermal issues, and more. With a maximum supply voltage of 34V and power supplies ranging from 12-24V, this compact device delivers efficient performance in a variety of applications. Whether you're working on automotive systems, industrial automation, or consumer electronics, the BTS712N1 provides the value, benefits, and advantages you need to bring your designs to life. Trust in Infineon Technologies for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the peripheral driver.

Surface Mount: YES

The surface mount design allows for easy installation and integration into electronic circuit boards.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of the peripheral driver by safeguarding against various potential issues such as over voltage or thermal overload.

Maximum Output Current: 1.7 A

With a maximum output current of 1.7 A, this peripheral driver is capable of providing sufficient power to drive external devices.

Technology: MOS

The MOS technology used in this peripheral driver offers high efficiency and performance in driving connected devices.

Technical Specifications

Peripheral Drivers BTS712N1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Output Current Flow Direction:

SINK

Maximum Output Current:

1.7 A

Nominal Output Peak Current Limit:

.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12/24

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

400 us

Turn-on Time:

400 us

Width:

7.6 mm

Trade Compliance

BTS712N1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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