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VND810MSP-E

STMicroelectronics

VND810MSP-E by STMicroelectronics

VND810MSP-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent and thermal issues. It features dual functions, supporting up to 0.9A output current. Ideal for automotive and industrial applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,134 parts In-Stock

1+ parts

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4,134

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Digiode

USA . 1,113 parts In-Stock

1+ parts

-

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-

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1,113

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Anansix

USA . 256 parts In-Stock

1+ parts

-

100+ parts

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256

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 211 parts In-Stock

1+ parts

$3.360

100+ parts

-

1k+ parts

-

10k+ parts

-

211

$3.360

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-

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AZTECH Wire

Italy . 926 parts In-Stock

1+ parts

$8.300

100+ parts

-

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-

926

$8.300

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IDEA Electronic Components Group

UK . 368 parts In-Stock

1+ parts

$12.665

100+ parts

-

1k+ parts

$11.398

10k+ parts

-

368

$12.665

-

$11.398

-

MKK Technologies

India . 2,158 parts In-Stock

1+ parts

$23.815

100+ parts

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2,158

$23.815

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DigiPath Technology Company

USA . 2,158 parts In-Stock

1+ parts

$23.815

100+ parts

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2,158

$23.815

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Corphita

USA . 2,485 parts In-Stock

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2,485

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Parana Technologies

USA . 1,763 parts In-Stock

1+ parts

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100+ parts

$15.143

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1,763

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$15.143

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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350

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Overview

Elevate your design with the VND810MSP-E from STMicroelectronics, a powerhouse in peripheral drivers that combines reliability and versatility. With robust built-in protections against overcurrent, voltage spikes, and thermal issues, this compact, surface-mount solution is perfect for automotive and industrial applications. Trust in ST's legacy of excellence to enhance your projects while enjoying peace of mind and superior performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space.

Maximum Supply Voltage: 36 V

A high maximum supply voltage provides versatility for various applications.

No. of Functions: 2

Multiple functions in one package reduce component count and streamline design.

Package Shape: RECTANGULAR

The rectangular shape is conducive for effective PCB layout and integration.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections ensure device safety and enhance reliability.

Power Supplies (V): 8/36

Flexibility in power supply range enhances compatibility across different systems.

No. of Terminals: 10

Ten terminals provide ample connectivity for various interfacing requirements.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline design with heat sink/slug improves thermal management in compact spaces.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage allows for operation in a wide range of low-power applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish ensures good solderability and enhances long-term reliability.

Terminal Position: DUAL

Dual terminal positions facilitate easier routing and integration into existing designs.

Maximum Seated Height: 3.75 mm

A low profile height facilitates more compact designs, critical for space-constrained applications.

Width: 7.5 mm

A moderate width allows for versatile placement on PCBs without requiring excessive space.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time tolerance allows for reliable soldering process in manufacturing.

Peak Reflow Temperature °C: 250

The high reflow temperature capability supports compatibility with lead-free soldering processes.

Length: 9.4 mm

The compact length helps in achieving dense layouts with minimal trace routing difficulties.

Maximum Output Current: 0.6 A

A maximum output current of 0.6 A is sufficient for driving many peripheral devices.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and excellent solder joint quality.

Nominal Supply Voltage: 13 V

Offers optimal performance at a common operational voltage, enhancing overall efficiency.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for compatibility with various PCB designs and layouts.

Driver No. of Bits: 2

A two-bit driver enables efficient control of multiple signals from one module.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate handling requirements, making it suitable for a variety of manufacturing environments.

Nominal Output Peak Current Limit: 0.9 A

The peak output current limit of 0.9 A ensures that the driver can handle surges without damage.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based driver allows for flexible interfacing and signal conditioning.

Output Current Flow Direction: SOURCE

Current sourced output enables direct connection to loads, simplifying circuit design.

Technical Specifications

Peripheral Drivers VND810MSP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.6 A

Nominal Output Peak Current Limit:

.9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND810MSP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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