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STR911FAW47X6

STMicroelectronics

STR911FAW47X6 by STMicroelectronics

STR911FAW47X6 by STMicroelectronics is a 32-bit ARM7 microcontroller ideal for industrial applications. It operates b/w 1.65V and 2V, features 128 terminals, and supports multiple connectivity options like CAN and USB. With an operating temp range of -40 °C to 85°C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,510 parts In-Stock

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7,510

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Anansix

USA . 2,009 parts In-Stock

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2,009

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Digiode

USA . 335 parts In-Stock

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335

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Avant Electronics Limited

UK . 166 parts In-Stock

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166

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,207 parts In-Stock

1+ parts

$15.560

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1,207

$15.560

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Microchip USA

USA . 315 parts In-Stock

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$20.771

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315

$20.771

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IDEA Electronic Components Group

UK . 1,286 parts In-Stock

1+ parts

$24.776

100+ parts

-

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$22.298

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1,286

$24.776

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$22.298

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MKK Technologies

India . 1,709 parts In-Stock

1+ parts

$46.589

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1,709

$46.589

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DigiPath Technology Company

USA . 1,709 parts In-Stock

1+ parts

$46.589

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1,709

$46.589

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Corphita

USA . 3,357 parts In-Stock

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3,357

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Parana Technologies

USA . 2,350 parts In-Stock

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$29.623

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2,350

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$29.623

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 560 parts In-Stock

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560

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Futuretech Components

Singapore . 206 parts In-Stock

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Overview

Elevate your projects with the STR911FAW47X6 microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers exceptional performance with this ARM7-based powerhouse, designed for diverse applications in industrial automation, automotive systems, and IoT devices. Benefit from its robust features like extensive connectivity options and low power consumption, ensuring reliable operation even in demanding environments. Unlock limitless possibilities and drive your technology forward with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protection for the microcontroller under various environmental conditions.

Surface Mount: YES

The surface mount design allows for compact assembly and integration into modern electronic devices, saving space on PCBs.

Maximum Supply Voltage: 2 V

A low maximum supply voltage helps ensure power efficiency and compatibility with low-power devices.

Package Shape: SQUARE

The square shape provides uniform footprint which is ideal for both layout and thermal management on circuit boards.

Bit Size: 32

The 32-bit architecture enables processing of complex calculations faster and enhances performance for advanced applications.

Power Supplies (V): 1.8, 3/3.3

Multiple operating voltage options increase flexibility for integration into various systems requiring different power levels.

No. of Terminals: 128

A large number of terminals provides various connectivity options, making it versatile for different application needs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style promotes efficient space utilization and is suitable for high-density circuit boards.

Minimum Supply Voltage: 1.65 V

A low minimum voltage ensures compatibility with low-voltage battery-operated devices, extending their battery life.

Maximum Operating Temperature: 85 °C

The capability to operate at higher temperatures makes this microcontroller suitable for industrial applications.

CPU Family: ARM7

Being part of the ARM7 family means excellent performance and power efficiency, making it ideal for embedded systems.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the microcontroller to function effectively in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and reduces the risk of corrosion, leading to longer device lifespan.

ADC Channels: YES

The presence of ADC channels enables analog data processing, essential for sensor applications.

DMA Channels: YES

DMA support enhances data throughput by allowing peripherals to access memory independently, improving overall performance.

Terminal Position: QUAD

Quad terminal configuration allows for a compact layout, which is essential for high-density designs.

ROM Words: 2097152

A substantial ROM capacity provides ample space for application code and firmware, enabling complex functionality.

Maximum Seated Height: 1.6 mm

The low seated height is beneficial for slim form-factor devices and helps in maintaining a low profile design.

Width: 14 mm

The compact width supports easy integration into space-constrained applications, making it very versatile.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

A rich set of peripherals ensures extensive functionality, reducing the need for external components.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for efficient processing and quick response times in applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification provides flexibility during manufacturing, ensuring the part can withstand reflow processes without damage.

Peak Reflow Temperature °C: 250

High reflow temperature capability allows compatibility with modern soldering techniques used in electronics assembly.

Length: 14 mm

The compact length complements its width for space-saving designs, facilitating the development of smaller devices.

Temperature Grade: INDUSTRIAL

An industrial grade means robust performance in demanding applications, ensuring reliability in critical uses.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient instruction processing, making it ideal for performance-sensitive applications.

RAM Bytes: 98304

With considerable RAM size, it supports complex algorithms and data processing tasks effectively.

Technology: CMOS

CMOS technology leads to lower power consumption, making it suited for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and assembly, ensuring reliability in electrical connections.

Analog To Digital Converters: 8-Ch 10-Bit

Having multiple ADC channels enhances the capability to interface with various sensors simultaneously.

Nominal Supply Voltage: 1.8 V

A nominal voltage of 1.8V optimizes power consumption and suits low-power application requirements.

PWM Channels: YES

PWM channels are essential for motor control and signal modulation, increasing versatility for various applications.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Diverse connectivity options ensure compatibility with a wide range of devices and protocols, enhancing integration flexibility.

ROM Programmability: FLASH

Flash memory programmability allows for easy updates and changes to the firmware, making the microcontroller adaptable over time.

Terminal Pitch: 0.4 mm

A small terminal pitch is suitable for high-density applications, allowing for more terminals in a smaller area.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, ensuring appropriate handling during manufacturing and assembly.

Speed: 96 rpm

This speed specification indicates suitability for applications requiring moderate response times, ensuring reliable functionality.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient code storage and processing elements in embedded systems.

No. of I/O Lines: 80

A high number of I/O lines provides significant interfacing capabilities with other hardware components, boosting device versatility.

Technical Specifications

Microcontrollers STR911FAW47X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR911FAW47X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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