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STR911FAW46X6

STMicroelectronics

STR911FAW46X6 by STMicroelectronics

STR911FAW46X6 from STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 2V and operates in -40 °C to 85°C. It features 128 terminals, 8 ADC channels, and supports various connectivity options like CAN and USB. Ideal for industrial applications requiring robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,746 parts In-Stock

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6,746

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Chip Stock

USA . 2,700 parts In-Stock

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2,700

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Digiode

USA . 2,659 parts In-Stock

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2,659

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Anansix

USA . 2,321 parts In-Stock

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2,321

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Distributors (Availability)

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AZTECH Wire

Italy . 40 parts In-Stock

1+ parts

$19.550

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-

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40

$19.550

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IDEA Electronic Components Group

UK . 1,853 parts In-Stock

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$45.410

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-

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$40.869

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1,853

$45.410

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$40.869

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Microchip USA

USA . 102 parts In-Stock

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$57.166

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102

$57.166

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MKK Technologies

India . 2,170 parts In-Stock

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$85.391

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2,170

$85.391

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DigiPath Technology Company

USA . 2,170 parts In-Stock

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$85.391

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2,170

$85.391

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Component Stockers USA

USA . 253 parts In-Stock

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$99.990

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253

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 25,905 parts In-Stock

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25,905

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Metaverse IC Inc.

Canada . 10,000 parts In-Stock

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Kepictronics

USA . 8,800 parts In-Stock

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8,800

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A-Z Elektronik GmbH

Germany . 7,322 parts In-Stock

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7,322

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Futuretech Components

Singapore . 4,240 parts In-Stock

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4,240

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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Corphita

USA . 1,493 parts In-Stock

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1,493

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Perfect Parts

USA . 560 parts In-Stock

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560

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Parana Technologies

USA . 309 parts In-Stock

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$54.295

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309

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$54.295

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Overview

Unlock innovation with the STR911FAW46X6 microcontroller from STMicroelectronics, a trusted leader in semiconductor solutions. Designed for versatility and efficiency, this powerful ARM7-based MCU excels in industrial and automotive applications, offering robust performance even in extreme conditions. With advanced features like enhanced connectivity options and low power consumption, it empowers designers to create smarter, more efficient devices that meet today’s demanding standards. Experience quality you can rely on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight packaging suitable for various applications.

Surface Mount: YES

Allows for compact design and automated assembly for efficient manufacturing.

Maximum Supply Voltage: 2 V

Suitable for low-power applications, enhancing energy efficiency.

Package Shape: SQUARE

Efficient space usage on PCB, aiding in high-density design.

Bit Size: 32

Provides sufficient data handling capabilities for complex applications.

Power Supplies (V): 1.8, 3/3.3

Versatile power supply options make integration into various systems easier.

No. of Terminals: 128

Offers extensive connectivity for diverse peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ideal for applications requiring low-profile components with minimal footprint.

Minimum Supply Voltage: 1.65 V

Flexible operation at lower voltages enhances energy savings.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications that operate in elevated temperature environments.

CPU Family: ARM7

Proven architecture with strong support from a vast ecosystem.

Minimum Operating Temperature: -40 °C

Robust performance in harsh environments, ensuring reliability.

Terminal Finish: MATTE TIN

Good solderability and reduces oxidation for reliable connections.

ADC Channels: YES

Allows for analog signal processing, making it suitable for sensor applications.

DMA Channels: YES

Improves data transfer efficiency, freeing up the CPU for other tasks.

Terminal Position: QUAD

Facilitates easy layout and robust connection on PCBs.

ROM Words: 1,048,576

Offers considerable program storage for complex applications.

Maximum Seated Height: 1.6 mm

Low profile allows for compact design in space-constrained applications.

Width: 14 mm

Compact size aids in designing smaller and more efficient PCBs.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

Rich set of peripherals enhances functionality for various application scenarios.

Maximum Clock Frequency: 25 MHz

Allows for fast processing and responsiveness in applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures compatibility with standard soldering processes, enhancing manufacturability.

Peak Reflow Temperature (°C): 250

Robust soldering temperature compatible with typical surface mount assembly.

Length: 14 mm

Suitable dimensions for a wide variety of embedded applications.

Temperature Grade: INDUSTRIAL

Engineered for long-term reliability in industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Optimized architecture for power efficiency and performance.

RAM Bytes: 98,304

Sufficient memory for executing complex tasks and data storage.

Technology: CMOS

Low power consumption and high noise immunity, ideal for portable applications.

Terminal Form: GULL WING

Promotes excellent solder joint characteristics for reliability.

Analog To Digital Converters: 8-Ch 10-Bit

Facilitates accurate conversion of analog signals for effective processing.

Nominal Supply Voltage: 1.8 V

Enables low-voltage operation, enhancing power efficiency.

PWM Channels: YES

Supports motor control and other applications requiring pulse width modulation.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Versatile connectivity options allow integration into diverse communication architectures.

ROM Programmability: FLASH

Flash ROM allows for easy updates and reprogramming in the field.

Terminal Pitch: 0.4 mm

Allows for high-density pin configuration, maximizing I/O capabilities.

Moisture Sensitivity Level (MSL): 3

Standard MSL rating ensures adequate handling and storage practices.

Speed: 96 rpm

Capable of handling moderate-speed processing tasks effectively.

On Chip Program ROM Width: 8

Ensures compatibility with standard architectures and software.

No. of I/O Lines: 80

Provides extensive options for interfacing with various peripherals and sensors.

Technical Specifications

Microcontrollers STR911FAW46X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR911FAW46X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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