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STR911FAM46X6

STMicroelectronics

STR911FAM46X6 by STMicroelectronics

STR911FAM46X6 microcontroller from STMicroelectronics features a 32-bit ARM7 CPU, operates at 1.65-2V, and supports up to 25 MHz clock speed. With 80 terminals and multiple connectivity options like CAN and USB, it's ideal for industrial applications. Its robust design includes ADC channels and DMA support for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,153 parts In-Stock

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Digiode

USA . 3,615 parts In-Stock

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3,615

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Anansix

USA . 553 parts In-Stock

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553

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Distributors (Availability)

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AZTECH Wire

Italy . 840 parts In-Stock

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$20.110

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840

$20.110

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IDEA Electronic Components Group

UK . 562 parts In-Stock

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$32.119

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$28.907

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562

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$28.907

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Microchip USA

USA . 449 parts In-Stock

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$53.671

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449

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MKK Technologies

India . 79 parts In-Stock

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$60.398

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79

$60.398

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DigiPath Technology Company

USA . 79 parts In-Stock

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$60.398

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79

$60.398

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Perfect Parts

USA . 15,994 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,765 parts In-Stock

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Corphita

USA . 2,639 parts In-Stock

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Parana Technologies

USA . 2,189 parts In-Stock

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$38.403

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$38.403

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Benley Electronics

USA . 324 parts In-Stock

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Overview

Unlock the potential of your projects with the STR911FAM46X6 microcontroller from STMicroelectronics. Renowned for their cutting-edge technology and reliability, STMicroelectronics delivers a robust solution designed for diverse applications, from industrial automation to IoT devices. With its efficient power management and versatile connectivity options, the STR911FAM46X6 empowers you to optimize performance while reducing energy costs, ensuring seamless integration into your next innovation. Experience superior quality and unmatched support—choose STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, ensuring the microcontroller is suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of automated assembly, making it ideal for space-constrained applications.

Maximum Supply Voltage: 2 V

With a low maximum supply voltage, this microcontroller is energy-efficient and suitable for battery-powered applications.

Package Shape: SQUARE

The square package shape can simplify PCB layout and optimize space utilization.

Bit Size: 32

A 32-bit architecture allows for higher performance and efficient processing of complex algorithms.

Power Supplies (V): 1.8, 3/3.3

Supports multiple voltage levels, enhancing compatibility with a wide range of power sources.

No. of Terminals: 80

A greater number of terminals enables more I/O options, increasing design flexibility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style allows for low-profile designs, beneficial for modern, compact electronic devices.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage enhances power efficiency, making it suitable for low-power applications.

Maximum Operating Temperature: 85 °C

High operating temperature rating ensures reliability in demanding environments.

CPU Family: ARM7

The ARM7 CPU family is well-known for its performance and low power consumption, making it a popular choice for embedded systems.

Minimum Operating Temperature: -40 °C

Able to operate in extreme cold conditions, this microcontroller supports a wide range of applications, including industrial and automotive.

ADC Channels: YES

Integrated ADC channels facilitate data acquisition from analog sensors, making it versatile for various applications.

DMA Channels: YES

DMA support allows for efficient data handling, reducing CPU workload and improving system performance.

Terminal Position: QUAD

Quad terminal positioning helps in maintaining good electrical performance and allows easier PCB routing.

ROM Words: 1048576

A large ROM capacity enables the microcontroller to store complex programs and applications directly on-chip.

Maximum Seated Height: 1.6 mm

This low seated height contributes to compact designs, making it suitable for modern electronics.

Width: 12 mm

The compact width is ideal for fitting into smaller circuit boards and designs.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

Rich peripheral set provides enhanced functionality and flexibility for various applications.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency allows for decent processing speeds, catering to a variety of applications.

Length: 12 mm

Being 12 mm in length aids in compact PCB layout designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and longevity in tough operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instructions and better performance, ideal for real-time processing tasks.

RAM Bytes: 98304

Ample RAM size allows for effective multitasking and support for complex applications.

Technology: CMOS

CMOS technology ensures lower power consumption and high integration, enhancing efficiency.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improved reliability in connections.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple 10-bit ADC channels enhance the microcontroller's ability to interface with a variety of sensors.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8 V ensures power efficiency, benefiting battery-powered designs.

PWM Channels: YES

PWM capability enables efficient control of motors and other devices, making it suitable for robotics and automation applications.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Comprehensive connectivity options make it adaptable for various communication standards, enhancing its utility in diverse applications.

ROM Programmability: FLASH

Flash programmability allows for reprogramming of the microcontroller, providing flexibility for updates and modifications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for higher density of connections, supporting more extensive functionality in smaller spaces.

Speed: 96 rpm

Achieving a speed of 96 rpm indicates suitability for control applications that require precise timing.

On Chip Program ROM Width: 8

The 8-bit ROM width facilitates efficient data alignment and processing in microcontroller applications.

No. of I/O Lines: 40

Having 40 I/O lines provides extensive input and output options, making it highly versatile for various projects.

Technical Specifications

Microcontrollers STR911FAM46X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR911FAM46X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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