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STR911FAM44X6

STMicroelectronics

STR911FAM44X6 by STMicroelectronics

STR911FAM44X6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 2V and operates b/w -40 °C to 85°C. It features 80 terminals, supports multiple connectivity options like CAN and USB, and includes ADC channels for versatile applications. Ideal for industrial use, it combines performance with low power consumption in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,258 parts In-Stock

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Chip Stock

USA . 4,356 parts In-Stock

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4,356

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Anansix

USA . 2,725 parts In-Stock

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2,725

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Digiode

USA . 1,413 parts In-Stock

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1,413

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LIBRA Elektronik GmbH

Germany . 6 parts In-Stock

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6

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Distributors (Availability)

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AZTECH Wire

Italy . 113 parts In-Stock

1+ parts

$21.730

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-

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113

$21.730

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$34.242

100+ parts

$33.899

1k+ parts

$32.530

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1,000

$34.242

$33.899

$32.530

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IDEA Electronic Components Group

UK . 2,284 parts In-Stock

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$42.227

100+ parts

-

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$38.004

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2,284

$42.227

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$38.004

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Microchip USA

USA . 435 parts In-Stock

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$44.288

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435

$44.288

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MKK Technologies

India . 1,119 parts In-Stock

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$79.405

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1,119

$79.405

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DigiPath Technology Company

USA . 1,119 parts In-Stock

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$79.405

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1,119

$79.405

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Corphita

USA . 4,609 parts In-Stock

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4,609

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A-Z Elektronik GmbH

Germany . 2,967 parts In-Stock

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Perfect Parts

USA . 2,154 parts In-Stock

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2,154

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Parana Technologies

USA . 1,057 parts In-Stock

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$50.489

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1,057

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$50.489

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the potential of your next project with the STR911FAM44X6 microcontroller from STMicroelectronics. Renowned for its superior quality and reliability, STMicroelectronics delivers a powerful 32-bit ARM7 core designed for diverse applications, from industrial automation to smart home solutions. With advanced features like multiple communication interfaces and robust temperature tolerance, this microcontroller ensures seamless performance while providing excellent energy efficiency. Elevate your innovations with the unmatched value and benefits that the STR911FAM44X6 offers!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection in various environments, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design, making integration into smaller devices simpler and more efficient.

Maximum Supply Voltage: 2 V

A low maximum supply voltage contributes to lower power consumption, enhancing battery life in portable applications.

Package Shape: SQUARE

The square package shape aids in efficient PCB layout and space optimization in electronic designs.

Bit Size: 32

The 32-bit architecture provides sufficient processing power for demanding applications, supporting more complex operations.

Power Supplies (V): 3/3.3

Versatility in power supply options allows for compatibility with a range of systems and applications.

No. of Terminals: 80

A larger number of terminals facilitate greater connectivity options and integration with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack style enhances thermal performance and provides a sleek design for modern electronic devices.

Minimum Supply Voltage: 1.65 V

The capability to operate at a low minimum supply voltage allows for energy-efficient designs and better battery performance.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance makes this microcontroller suitable for harsh environments, enhancing reliability.

CPU Family: ARM7

The ARM7 architecture is widely supported and recognized for good performance, making it an excellent choice for embedded applications.

Minimum Operating Temperature: -40 °C

A wide temperature range enables operation in extreme conditions, proving its robustness in various industrial settings.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and enhances the durability of interconnections.

ADC Channels: YES

Inclusion of ADC channels allows for efficient processing of analog signals, ideal for sensor interfaces.

DMA Channels: YES

DMA channels enhance data transfer rates, minimizing CPU load and improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning provides better connectivity options and simplifies PCB layout.

ROM Words: 524288

The significant ROM capacity allows for ample firmware storage, making it capable of handling complex applications.

Maximum Seated Height: 1.6 mm

A low seated height contributes to space-saving designs, which are critical in compact electronic systems.

Width: 12 mm

Compact dimensions enable integration into smaller devices without compromising on performance.

Peripherals: BOD, DMA(9), POR, RTC, TIMER(4), WDT

Rich peripheral features support diverse applications, increasing the versatility of this microcontroller.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for the efficient execution of complex tasks and processing needs.

Length: 12 mm

Small size is beneficial for compact projects where real estate on the PCB is limited.

Temperature Grade: INDUSTRIAL

Industrial-grade rating ensures reliability and performance in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances execution efficiency, leading to faster processing and reduced power consumption.

RAM Bytes: 98304

Adequate RAM size supports multitasking and complex algorithms, enhancing application performance.

Technology: CMOS

CMOS technology provides lower power consumption and improved performance, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and assembly, simplifying manufacturing processes.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADCs enable precise conversion of signals, essential for high-accuracy applications.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage allows for efficient operation in energy-sensitive applications.

PWM Channels: YES

PWM capability enables control of motors and lighting, broadening its application spectrum.

Connectivity: CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Diverse connectivity options provide flexibility in design, facilitating integration with a variety of devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, enhancing product longevity.

Terminal Pitch: 0.5 mm

Fine pitch terminals are essential for high-density designs, accommodating modern, compact electronics.

Speed: 96 rpm

Operates effectively across a wide range of application speeds, making it suitable for dynamic projects.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient data processing and easier programming.

No. of I/O Lines: 40

A higher number of I/O lines significantly increases the functionality and scope of designs, allowing for versatile applications.

Technical Specifications

Microcontrollers STR911FAM44X6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

96 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, MICROWIRE(2), SPI(2), SSI(2), UART(3), USB

Peripherals:

BOD, DMA(9), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

STR911FAM44X6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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