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STGP7NB60KD

STMicroelectronics

STGP7NB60KD by STMicroelectronics

STGP7NB60KD by STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600V, 14A collector current, and a fast turn-off time of 202ns. Ideal for high-performance switching in industrial systems.

Median Price

$3.170

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 50 parts In-Stock

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$3.170

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50

$3.170

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Vyrian

USA . 4,429 parts In-Stock

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4,429

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Digiode

USA . 3,983 parts In-Stock

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3,983

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Anansix

USA . 2,883 parts In-Stock

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2,883

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Corel Iberica Componentes, S.L.

Spain . 96 parts In-Stock

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96

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Pegasus Components GmbH

Germany . 44 parts In-Stock

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44

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$1.232

100+ parts

$1.121

1k+ parts

$1.010

10k+ parts

-

100

$1.232

$1.121

$1.010

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IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$1.272

100+ parts

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$1.145

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1,546

$1.272

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$1.145

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MKK Technologies

India . 1,799 parts In-Stock

1+ parts

$2.393

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1,799

$2.393

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DigiPath Technology Company

USA . 1,799 parts In-Stock

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$2.393

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1,799

$2.393

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AZTECH Wire

Italy . 1,014 parts In-Stock

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$22.070

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1,014

$22.070

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A-Z Elektronik GmbH

Germany . 6,449 parts In-Stock

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6,449

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Corphita

USA . 1,030 parts In-Stock

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1,030

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Parana Technologies

USA . 854 parts In-Stock

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$1.521

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854

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$1.521

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Assy Fe

Spain . 220 parts In-Stock

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Overview

Unlock the power of efficiency and reliability with the STGP7NB60KD from STMicroelectronics. Renowned for their innovation and quality, STMicroelectronics delivers an IGBT that excels in power control applications, ensuring optimal performance in demanding environments. With its robust design and built-in diode, this N-channel transistor offers unmatched thermal stability and fast switching times, providing customers with exceptional value and enhanced operational efficiency. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material enhances heat resistance and reliability in harsh environments.

Polarity or Channel Type: N-CHANNEL

N-channel configuration is known for better efficiency and lower on-state resistance, making it ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for improved switching performance and simplifies design in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT excels in managing large amounts of electrical power.

Package Shape: RECTANGULAR

Rectangular shape ensures easy mounting and space-efficient layout on PCB.

Terminal Form: THROUGH-HOLE

Through-hole terminal design provides enhanced mechanical stability and robustness in circuit assemblies.

Nominal Turn Off Time (toff): 202 ns

Fast turn-off time allows for efficient switching, reducing losses and enhancing performance in power applications.

No. of Terminals: 3

Three terminals facilitate simple and versatile connections in various circuit designs.

Maximum Power Dissipation (Abs): 95 W

High power dissipation capability ensures reliable performance under demanding operational conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides additional stability and ease of mounting in industrial applications.

Maximum Operating Temperature: 150 °C

High operating temperature rating allows for reliable operation in extreme thermal conditions.

Maximum Collector-Emitter Voltage: 600 V

A 600 V rating enables usage in high-voltage power control applications, expanding its application scope.

Transistor Element Material: SILICON

Silicon material offers excellent electrical properties, ensuring efficient conduction and switching.

Maximum Gate-Emitter Voltage: 20 V

Robust gate-emitter voltage rating ensures the device can operate safely under high gate voltages.

Maximum Collector Current (IC): 14 A

14 A current capacity makes this IGBT suitable for medium to high power applications while maintaining efficiency.

Maximum Gate-Emitter Threshold Voltage: 7 V

A threshold voltage of 7 V ensures reliable switching with standard gate drive voltages.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring a robust connection.

Terminal Position: SINGLE

Single terminal position simplifies layout and minimizes design complexity in circuits.

Nominal Turn On Time (ton): 21 ns

Quick turn-on time allows for fast switching applications, reducing overall circuit response time.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP7NB60KD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

202 ns

Nominal Turn On Time (ton):

21 ns

Trade Compliance

STGP7NB60KD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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