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STGP19NC60WD

STMicroelectronics

STGP19NC60WD by STMicroelectronics

STGP19NC60WD from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600V, 40A collector current, and a fast turn-off time of 204ns. Ideal for high-performance switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,826 parts In-Stock

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2,826

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Digiode

USA . 2,768 parts In-Stock

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2,768

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Anansix

USA . 549 parts In-Stock

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549

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 705 parts In-Stock

1+ parts

$0.281

100+ parts

-

1k+ parts

$0.253

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705

$0.281

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$0.253

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MKK Technologies

India . 2,123 parts In-Stock

1+ parts

$0.528

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2,123

$0.528

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DigiPath Technology Company

USA . 2,123 parts In-Stock

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$0.528

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2,123

$0.528

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AZTECH Wire

Italy . 218 parts In-Stock

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$20.470

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218

$20.470

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RC Electronics

USA . 15,533 parts In-Stock

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15,533

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 2,132 parts In-Stock

1+ parts

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$0.336

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2,132

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$0.336

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A-Z Elektronik GmbH

Germany . 1,769 parts In-Stock

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1,769

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Corphita

USA . 1,212 parts In-Stock

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1,212

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Perfect Parts

USA . 1,121 parts In-Stock

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1,121

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Overview

Unlock unparalleled performance with the STGP19NC60WD IGBT from STMicroelectronics—a trusted leader in semiconductor solutions. Designed for efficient power control, this N-channel transistor excels in demanding applications, ensuring reliability under high temperatures and heavy loads. With its robust built-in diode, it delivers seamless operation, optimizing energy efficiency and reducing downtime. Experience the quality and innovation that come with STMicroelectronics, elevating your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures reliability and longevity in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration contributes to better efficiency and performance in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and improved performance in rectification tasks.

Transistor Application: POWER CONTROL

Ideal for power control applications, providing robust performance in high-power situations.

Package Shape: RECTANGULAR

Rectangular packaging design enhances thermal management and mechanical stability.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connection and are easier to solder, making assembly simpler.

Nominal Turn Off Time (toff): 204 ns

Fast turn-off time improves switching efficiency and reduces power losses during operation.

No. of Terminals: 3

Three terminals provide versatile connection options while maintaining simplicity in circuit design.

Maximum Power Dissipation (Abs): 125 W

High power dissipation capability allows for greater performance in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure mounting and enhances thermal conductivity for effective heat dissipation.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliable performance in harsh environments.

Maximum Collector-Emitter Voltage: 600 V

With a high maximum voltage rating, this IGBT is suitable for a wide range of high-voltage applications.

Transistor Element Material: SILICON

Silicon material provides excellent electrical characteristics, ensuring overall durability and performance.

Maximum Gate-Emitter Voltage: 20 V

A high gate-emitter voltage tolerance allows for flexible control strategies in circuit design.

Maximum Collector Current (IC): 40 A

High collector current rating enables this transistor to handle substantial loads without overheating.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

Low threshold voltage allows for easy driving of the IGBT, simplifying control circuit design.

Terminal Finish: Matte Tin (Sn)

Matte tin finish enhances solderability and ensures strong electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies layout and circuit design, ideal for compact applications.

Nominal Turn On Time (ton): 33 ns

Rapid turn-on time promotes high-frequency operation, improving overall system efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP19NC60WD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

204 ns

Nominal Turn On Time (ton):

33 ns

Trade Compliance

STGP19NC60WD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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