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STGP19NC60S

STMicroelectronics

STGP19NC60S by STMicroelectronics

STGP19NC60S by STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, a power dissipation of 125 W, and operates at up to 150 °C. Its fast switching times (ton: 23.5 ns, toff: 535 ns) enhance performance in various electronic systems.

Median Price

$4.490

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 428 parts In-Stock

1+ parts

$4.490

100+ parts

$2.135

1k+ parts

-

10k+ parts

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428

$4.490

$2.135

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,880 parts In-Stock

1+ parts

$5.016

100+ parts

-

1k+ parts

-

10k+ parts

-

1,880

$5.016

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Vyrian

USA . 2,578 parts In-Stock

1+ parts

-

100+ parts

-

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2,578

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Anansix

USA . 1,820 parts In-Stock

1+ parts

-

100+ parts

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1,820

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$0.439

100+ parts

$0.399

1k+ parts

$0.360

10k+ parts

-

20

$0.439

$0.399

$0.360

-

IDEA Electronic Components Group

UK . 2,367 parts In-Stock

1+ parts

$1.135

100+ parts

-

1k+ parts

$1.022

10k+ parts

-

2,367

$1.135

-

$1.022

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MKK Technologies

India . 634 parts In-Stock

1+ parts

$2.135

100+ parts

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634

$2.135

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DigiPath Technology Company

USA . 634 parts In-Stock

1+ parts

$2.135

100+ parts

-

1k+ parts

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10k+ parts

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634

$2.135

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Corphita

USA . 3,282 parts In-Stock

1+ parts

$4.752

100+ parts

-

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3,282

$4.752

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Microchip USA

USA . 6,778 parts In-Stock

1+ parts

$27.105

100+ parts

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6,778

$27.105

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Parana Technologies

USA . 876 parts In-Stock

1+ parts

-

100+ parts

$1.357

1k+ parts

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10k+ parts

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876

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$1.357

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Perfect Parts

USA . 561 parts In-Stock

1+ parts

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561

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Overview

Unlock exceptional power control with the STGP19NC60S from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers this robust N-channel IGBT, perfect for a range of applications from industrial automation to renewable energy systems. With superior thermal performance and reliability, this component empowers your designs with efficiency and durability, ensuring optimal performance in demanding environments. Experience the benefits of trusted engineering excellence—choose the STGP19NC60S and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and resistance to environmental factors, enhancing reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally offer better performance and efficiency, particularly in power control applications, making this product suitable for high-performance systems.

Configuration: SINGLE

A single configuration keeps the design simple and compact, which is ideal for minimizing space in circuit designs.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is capable of handling high power loads, making it an excellent choice for energy-intensive applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout and can facilitate better thermal management in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections and are often favored in high-power applications, ensuring reliability in electrical connections.

Nominal Turn Off Time (toff): 535 ns

With a nominal turn off time of 535 ns, this IGBT allows for rapid switching, leading to increased efficiency and reduced power losses in high-frequency applications.

No. of Terminals: 3

Having three terminals simplifies circuit design and makes it easier to implement in various applications while providing necessary connections for stability.

Maximum Power Dissipation (Abs): 125 W

A maximum power dissipation of 125 W indicates this IGBT can handle significant power without overheating, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures good heat dissipation and allows for secure mounting, enhancing the reliability of the IGBT in operational environments.

Maximum Operating Temperature: 150 °C

The ability to operate at temperatures up to 150 °C ensures reliability and performance even in high-temperature settings, broadening application possibilities.

Maximum Collector-Emitter Voltage: 600 V

A maximum collector-emitter voltage of 600 V allows this IGBT to handle demanding voltage conditions, ideal for high-voltage applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material with excellent performance characteristics, contributing to the overall efficiency and effectiveness of the IGBT.

Maximum Gate-Emitter Voltage: 20 V

A gate-emitter voltage capacity of up to 20 V offers flexibility in driving requirements, allowing it to be compatible with various control circuits.

Maximum Collector Current (IC): 50 A

With a maximum collector current of 50 A, this IGBT is capable of managing substantial load currents, making it well-suited for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A low gate-emitter threshold voltage of 5.75 V increases the efficiency of gate drive circuits, leading to improved overall power management.

Terminal Position: SINGLE

Single terminal position simplifies design layout and facilitates easier PCB routing for efficient circuit designs.

Case Connection: COLLECTOR

Collector case connection enhances the thermal performance and ensures stable operation in demanding conditions.

Nominal Turn On Time (ton): 23.5 ns

A nominal turn on time of 23.5 ns ensures quick response time, making this IGBT ideal for high-speed switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP19NC60S attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Additional Features:

FREE WHEELING DIODE

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

535 ns

Nominal Turn On Time (ton):

23.5 ns

Trade Compliance

STGP19NC60S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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