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STGF8NC60KD

STMicroelectronics

STGF8NC60KD by STMicroelectronics

STGF8NC60KD by STMicroelectronics is an N-channel IGBT ideal for power control applications. It features a max collector-emitter voltage of 600V, a turn-off time of 242ns, and can handle up to 7A current. Its robust design ensures reliable performance in demanding environments.

Median Price

$1.780

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5 parts In-Stock

1+ parts

$1.780

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$1.780

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,486 parts In-Stock

1+ parts

$1.995

100+ parts

-

1k+ parts

-

10k+ parts

-

2,486

$1.995

-

-

-

Vyrian

USA . 5,646 parts In-Stock

1+ parts

-

100+ parts

-

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5,646

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-

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ComSIT Distribution GmbH

Germany . 2,950 parts In-Stock

1+ parts

-

100+ parts

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2,950

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Anansix

USA . 2,250 parts In-Stock

1+ parts

-

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1k+ parts

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2,250

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7 parts In-Stock

1+ parts

$1.780

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$1.780

-

-

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IDEA Electronic Components Group

UK . 2,368 parts In-Stock

1+ parts

$1.837

100+ parts

-

1k+ parts

$1.654

10k+ parts

-

2,368

$1.837

-

$1.654

-

Corphita

USA . 3,852 parts In-Stock

1+ parts

$1.890

100+ parts

-

1k+ parts

-

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-

3,852

$1.890

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-

-

MKK Technologies

India . 573 parts In-Stock

1+ parts

$3.455

100+ parts

-

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10k+ parts

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573

$3.455

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DigiPath Technology Company

USA . 573 parts In-Stock

1+ parts

$3.455

100+ parts

-

1k+ parts

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573

$3.455

-

-

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Microchip USA

USA . 420 parts In-Stock

1+ parts

$9.620

100+ parts

-

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420

$9.620

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-

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RC Electronics

USA . 6,305 parts In-Stock

1+ parts

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6,305

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A-Z Elektronik GmbH

Germany . 5,303 parts In-Stock

1+ parts

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5,303

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Kepictronics

USA . 922 parts In-Stock

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922

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Perfect Parts

USA . 726 parts In-Stock

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726

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Parana Technologies

USA . 445 parts In-Stock

1+ parts

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100+ parts

$2.197

1k+ parts

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445

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$2.197

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Overview

Unlock unparalleled efficiency with the STGF8NC60KD from STMicroelectronics, a premier choice for power control applications. Designed for reliability and performance, this N-channel IGBT combines superior thermal management with swift switching capabilities, ensuring your systems run smoothly even under demanding conditions. With STMicroelectronics' renowned commitment to quality, you can trust this device to enhance your projects, delivering exceptional value and robust solutions for industrial, automotive, and renewable energy sectors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers good insulation properties and protects the transistor from environmental factors, enhancing its durability.

Polarity or Channel Type: N-CHANNEL

N-channel type IGBTs are known for their high efficiency and performance in power control applications, making them a preferred choice in many circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode allows for easier integration into circuits, providing both switching and rectification functionality.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT can effectively manage high voltage and current, making it ideal for various industrial applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient thermal management and spatial efficiency in mounting, contributing to improved performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and easier soldering, making installation straightforward in various applications.

Nominal Turn Off Time (toff): 242 ns

A relatively short turn off time allows for faster switching, which is essential for applications requiring dynamic response and efficiency.

No. of Terminals: 3

Having three terminals simplifies the circuit design while ensuring effective control and signal manipulation capabilities.

Maximum Power Dissipation (Abs): 24 W

With a power dissipation capability of 24 W, this IGBT can handle substantial power levels, ensuring reliable performance in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style enhances thermal conductivity and mounting stability, making it easier to manage heat during operation.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for versatile use in high-temperature environments, ensuring durability and longevity.

Maximum Collector-Emitter Voltage: 600 V

With a collector-emitter voltage rating of 600 V, this IGBT can operate efficiently in high-voltage applications, providing wide applicability.

Transistor Element Material: SILICON

Silicon as the semiconductor material ensures reliable performance and efficiency in power conversion and control applications.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V allows for compatibility with various control circuits, enhancing flexibility in design.

Maximum Collector Current (IC): 7 A

The ability to handle up to 7 A of collector current makes this IGBT suitable for medium power applications while maintaining reliable operation.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The relatively low gate-emitter threshold voltage allows for efficient gating control, minimizing power loss during operation.

Terminal Position: SINGLE

A single terminal position simplifies circuit integration and reduces complexity in PCB design, improving overall design efficiency.

Case Connection: ISOLATED

Isolated case connections improve safety and reduce the risk of short circuits, enhancing the overall reliability of the device.

Nominal Turn On Time (ton): 23 ns

With a nominal turn on time of 23 ns, this IGBT ensures fast switching, contributing to efficient operation in fast-paced applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGF8NC60KD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

7 A

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

242 ns

Nominal Turn On Time (ton):

23 ns

Trade Compliance

STGF8NC60KD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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