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STCD2320F35F

STMicroelectronics

STCD2320F35F by STMicroelectronics

STCD2320F35F by STMicroelectronics is a clock driver in plastic/epoxy package with 12 terminals. It operates at 3/5V, -20 to 85 °C, and has a 0.4mm terminal pitch. Ideal for applications requiring precise clock signal distribution in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,438

-

-

-

-

Anansix

USA . 2,817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,817

-

-

-

-

Vyrian

USA . 1,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,620

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 424 parts In-Stock

1+ parts

$7.188

100+ parts

-

1k+ parts

$6.901

10k+ parts

$6.901

424

$7.188

-

$6.901

$6.901

IDEA Electronic Components Group

UK . 145 parts In-Stock

1+ parts

$7.992

100+ parts

-

1k+ parts

$7.193

10k+ parts

-

145

$7.992

-

$7.193

-

MKK Technologies

India . 1,710 parts In-Stock

1+ parts

$15.029

100+ parts

-

1k+ parts

-

10k+ parts

-

1,710

$15.029

-

-

-

DigiPath Technology Company

USA . 1,710 parts In-Stock

1+ parts

$15.029

100+ parts

-

1k+ parts

-

10k+ parts

-

1,710

$15.029

-

-

-

Corphita

USA . 2,672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,672

-

-

-

-

Parana Technologies

USA . 2,048 parts In-Stock

1+ parts

-

100+ parts

$9.556

1k+ parts

-

10k+ parts

-

2,048

-

$9.556

-

-

Overview

Discover the STCD2320F35F by STMicroelectronics, a high-quality clock driver and buffer designed to enhance the performance of your electronic devices. With a reputation for reliability and innovation, STMicroelectronics delivers products that meet the highest industry standards. Ideal for a wide range of applications, this product offers customers unmatched value, benefits, and advantages. Upgrade your systems with the STCD2320F35F and experience improved efficiency and functionality like never before. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard PCB layouts and makes it easy to integrate into existing designs.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies makes this product versatile and suitable for a wide range of voltage requirements.

No. of Terminals: 12

Having 12 terminals provides flexibility in connecting to other components and interfaces, allowing for complex circuit designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style enables high-density mounting and precise alignment of the terminals, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand elevated temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C allows this product to function effectively in cold environments without any issues.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and facilitates easy soldering and connection, enhancing the overall ease of use.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, ensuring good electrical contact and reducing the risk of signal loss.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm allows for high-density mounting and precise alignment of terminals, making it suitable for compact electronic designs.

Technical Specifications

Clock Drivers & Buffers STCD2320F35F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B12

Logic IC Type:

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

STCD2320F35F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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