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STCD1020RDG6F

STMicroelectronics

STCD1020RDG6F by STMicroelectronics

STCD1020RDG6F Clock Driver by STMicroelectronics operates at -40 to 85 °C, with Vsup of 2.8V. It has 8 terminals in a small outline package, suitable for industrial applications requiring precise clock signal distribution.

Median Price

$0.975

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.975

875

-

-

-

$0.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,487 parts In-Stock

1+ parts

-

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-

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-

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4,487

-

-

-

-

Digiode

USA . 3,031 parts In-Stock

1+ parts

-

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3,031

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-

-

-

Anansix

USA . 1,188 parts In-Stock

1+ parts

-

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1,188

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-

-

Bristol Electronics

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$1.125

1k+ parts

-

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200

-

$1.125

-

-

Microfarads

USA . 193 parts In-Stock

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-

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193

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-

Distributors (Availability)

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Microchip USA

USA . 151 parts In-Stock

1+ parts

$4.680

100+ parts

-

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-

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-

151

$4.680

-

-

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Andel Nordic

Denmark . 140 parts In-Stock

1+ parts

$7.846

100+ parts

-

1k+ parts

$7.532

10k+ parts

$7.532

140

$7.846

-

$7.532

$7.532

IDEA Electronic Components Group

UK . 900 parts In-Stock

1+ parts

$20.380

100+ parts

-

1k+ parts

$18.342

10k+ parts

-

900

$20.380

-

$18.342

-

MKK Technologies

India . 1,655 parts In-Stock

1+ parts

$38.323

100+ parts

-

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10k+ parts

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1,655

$38.323

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DigiPath Technology Company

USA . 1,655 parts In-Stock

1+ parts

$38.323

100+ parts

-

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1,655

$38.323

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-

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Perfect Parts

USA . 11,803 parts In-Stock

1+ parts

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11,803

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Corphita

USA . 3,494 parts In-Stock

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3,494

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-

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Parana Technologies

USA . 2,194 parts In-Stock

1+ parts

-

100+ parts

$24.367

1k+ parts

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10k+ parts

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2,194

-

$24.367

-

-

Overview

Unlock the potential of your electronic projects with the STCD1020RDG6F clock driver and buffer by STMicroelectronics. Crafted with precision and expertise, this high-quality component is designed to enhance the performance of your devices with its reliable operation and durable construction. Ideal for a wide range of applications, this product offers unmatched value, providing customers with seamless integration, efficiency, and versatility. Elevate your designs and experience the benefits of superior technology with the STCD1020RDG6F from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving valuable space on the board.

Package Shape: RECTANGULAR

The rectangular package shape ensures easy integration into existing PCB designs and layouts.

Nominal Supply Voltage / Vsup (V): 2.8

With a nominal supply voltage of 2.8V, this clock driver and buffer is suitable for low power and battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C makes this product reliable and suitable for industrial applications that may experience elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that this product can function effectively in cold environments or during temperature fluctuations.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish with annealing provides good solderability and resistance to corrosion, ensuring reliable connections.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density mounting and compact PCB designs.

Technical Specifications

Clock Drivers & Buffers STCD1020RDG6F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.8

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

2.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STCD1020RDG6F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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