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STCD2310F35F

STMicroelectronics

STCD2310F35F by STMicroelectronics

STCD2310F35F by STMicroelectronics is a clock driver in PLASTIC/EPOXY package with 12 terminals. It operates at 3/5V, -20 to 85 °C, and has 0.4mm terminal pitch. Ideal for applications requiring precise clock signal distribution in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,096

-

-

-

-

Anansix

USA . 1,623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,623

-

-

-

-

Vyrian

USA . 683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

683

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,863 parts In-Stock

1+ parts

$3.200

100+ parts

-

1k+ parts

$3.072

10k+ parts

$3.072

3,863

$3.200

-

$3.072

$3.072

IDEA Electronic Components Group

UK . 159 parts In-Stock

1+ parts

$24.159

100+ parts

-

1k+ parts

$21.743

10k+ parts

-

159

$24.159

-

$21.743

-

MKK Technologies

India . 37 parts In-Stock

1+ parts

$45.430

100+ parts

-

1k+ parts

-

10k+ parts

-

37

$45.430

-

-

-

DigiPath Technology Company

USA . 37 parts In-Stock

1+ parts

$45.430

100+ parts

-

1k+ parts

-

10k+ parts

-

37

$45.430

-

-

-

Corphita

USA . 2,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,637

-

-

-

-

Parana Technologies

USA . 2,351 parts In-Stock

1+ parts

-

100+ parts

$28.886

1k+ parts

-

10k+ parts

-

2,351

-

$28.886

-

-

Overview

Enhance the performance of your electronic devices with the STCD2310F35F clock driver and buffer by STMicroelectronics. Known for their impeccable quality and reliability, STMicroelectronics delivers cutting-edge solutions for a wide range of applications. Whether you're designing consumer electronics, industrial equipment, or automotive systems, this product offers unmatched value, benefits, and advantages. Say goodbye to compatibility issues and hello to seamless operation with the STCD2310F35F. Upgrade your devices today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability, ensuring the product can withstand various environmental conditions without deterioration.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Rectangular shape provides a standard form factor that is compatible with many existing design layouts and makes integration into circuits straightforward.

Power Supplies (V): 3/5

Support for dual power supplies of 3V and 5V allows for versatile use in different electronic systems that may require varying voltage inputs.

No. of Terminals: 12

Having 12 terminals provides ample connectivity options for interfacing with other components or circuits, increasing flexibility in design implementation.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enables high-density mounting, optimizing space utilization on the circuit board and facilitating compact system designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is suitable for use in applications where elevated temperatures may be encountered, ensuring reliability under varying conditions.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20 °C makes this product suitable for use in cold environments or applications that require reliable performance in sub-zero conditions.

Terminal Position: BOTTOM

Bottom terminal positioning makes it easier to mount and connect the product on the circuit board, simplifying assembly and enhancing overall system efficiency.

Terminal Form: BALL

The ball terminal form provides secure and reliable electrical connections, reducing the risk of connectivity issues or signal interruptions, ensuring consistent performance.

Terminal Pitch: 0.4 mm

Having a small terminal pitch of 0.4mm enables high-density mounting and precise alignment, allowing for efficient integration into complex circuit layouts and enhancing overall system reliability.

Technical Specifications

Clock Drivers & Buffers STCD2310F35F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B12

Logic IC Type:

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

STCD2310F35F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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