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STCD23000F35F

STMicroelectronics

STCD23000F35F by STMicroelectronics

STCD23000F35F from STMicroelectronics is a compact clock driver with a 6 ns propagation delay and operates b/w 2.5V to 5.1V. It features an open-drain output and supports up to 4 true outputs, ideal for high-speed applications in tight spaces. Its thin profile design ensures efficient use in modern electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,370 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,370

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-

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Anansix

USA . 1,535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,535

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Vyrian

USA . 1,192 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,192

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 168 parts In-Stock

1+ parts

$4.184

100+ parts

-

1k+ parts

$4.017

10k+ parts

$4.017

168

$4.184

-

$4.017

$4.017

IDEA Electronic Components Group

UK . 2,316 parts In-Stock

1+ parts

$10.363

100+ parts

-

1k+ parts

$9.327

10k+ parts

-

2,316

$10.363

-

$9.327

-

MKK Technologies

India . 1,915 parts In-Stock

1+ parts

$19.487

100+ parts

-

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10k+ parts

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1,915

$19.487

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DigiPath Technology Company

USA . 1,915 parts In-Stock

1+ parts

$19.487

100+ parts

-

1k+ parts

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10k+ parts

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1,915

$19.487

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-

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Parana Technologies

USA . 1,426 parts In-Stock

1+ parts

-

100+ parts

$12.390

1k+ parts

-

10k+ parts

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1,426

-

$12.390

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-

Corphita

USA . 1,092 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,092

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Overview

Unlock the potential of your electronic designs with the STCD23000F35F from STMicroelectronics, a trusted leader in innovative solutions. This state-of-the-art clock driver and buffer delivers exceptional performance and reliability, ensuring seamless operation in a variety of applications. With its ultra-thin profile and robust thermal range, it fits perfectly in compact spaces while providing efficient signal integrity. Elevate your projects with unmatched quality and cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making this clock driver robust for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling space-efficient layouts on PCBs while also improving manufacturing efficiency.

Input Conditioning: STANDARD

Standard input conditioning implies compatibility with common signal formats, making integration into existing designs straightforward.

Package Shape: RECTANGULAR

The rectangular shape facilitates better fitting options within the PCB layout, optimizing space utilization and thermal management.

Nominal Supply Voltage / Vsup: 3.8 V

A nominal supply voltage of 3.8 V provides a balance between power consumption and performance, ideal for battery-operated devices.

No. of Terminals: 12

Having 12 terminals offers versatile connectivity options for various applications, ensuring easy integration into complex circuits.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This very thin profile and fine pitch design enhances density on the PCB and caters to high-performance systems with space constraints.

Propagation Delay (tpd): 6 ns

A propagation delay of only 6 ns enables fast signal processing, crucial for high-speed applications requiring precision timing.

Maximum Operating Temperature: 85 °C

Operating reliably up to 85 °C ensures performance in demanding environments, making this product suitable for industrial applications.

Output Characteristics: OPEN-DRAIN

Open-drain output configuration allows for flexibility in interfacing with various pull-up resistor values, suitable for multiple signal environments.

Minimum Operating Temperature: -20 °C

The capability to operate at low temperatures down to -20 °C ensures reliability in cold conditions, expanding application possibilities.

Terminal Position: BOTTOM

Bottom terminals facilitate easier thermal dissipation and enhance assembly efficiency, leading to improved overall system reliability.

Maximum Seated Height: 0.66 mm

A maximum seated height of 0.66 mm contributes to a low-profile design, essential for compact devices and integration into slim profiles.

Width: 1.2 mm

With a width of just 1.2 mm, this component fits into tight spaces, allowing for compact and efficient board designs.

Minimum Supply Voltage (Vsup): 2.5 V

A minimum supply voltage of 2.5 V supports low-power designs, making this driver ideal for energy-efficient systems.

Length: 1.6 mm

A length of 1.6 mm aids in achieving compact designs, which can be crucial in space-constrained applications.

Terminal Form: BALL

The ball terminal form enhances mechanical stability and provides reliable electrical connection, crucial for high-density board applications.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm is suited for high-density designs, allowing for more I/O connections in a confined space.

No. of True Outputs: 4

Four true outputs provide flexibility in generating multiple clock signals, enhancing versatility in design and application.

Maximum Supply Voltage (Vsup): 5.1 V

Supporting up to 5.1 V supply voltage extends the range of compatible circuit designs, accommodating various operational requirements.

Technical Specifications

Clock Drivers & Buffers STCD23000F35F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

2300

Input Conditioning:

STANDARD

JESD-30 Code:

R-PBGA-B12

Length:

1.6 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

12

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

.66 mm

Maximum Supply Voltage (Vsup):

5.1 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.2 mm

Trade Compliance

STCD23000F35F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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