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STCD1020RDG6E

STMicroelectronics

STCD1020RDG6E by STMicroelectronics

STCD1020RDG6E from STMicroelectronics is a compact clock driver with a supply voltage range of 2.5-3.6V and operates in extreme temperatures from -40 °C to 85 °C. It features dual true outputs and comes in a small, thin profile package. Ideal for industrial applications requiring reliable timing solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,827 parts In-Stock

1+ parts

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2,827

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Digiode

USA . 854 parts In-Stock

1+ parts

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854

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Vyrian

USA . 703 parts In-Stock

1+ parts

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703

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 411 parts In-Stock

1+ parts

$4.581

100+ parts

-

1k+ parts

$4.398

10k+ parts

$4.398

411

$4.581

-

$4.398

$4.398

IDEA Electronic Components Group

UK . 274 parts In-Stock

1+ parts

$15.658

100+ parts

-

1k+ parts

$14.093

10k+ parts

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274

$15.658

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$14.093

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MKK Technologies

India . 1,093 parts In-Stock

1+ parts

$29.445

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1,093

$29.445

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DigiPath Technology Company

USA . 1,093 parts In-Stock

1+ parts

$29.445

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1,093

$29.445

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Corphita

USA . 1,109 parts In-Stock

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1,109

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Parana Technologies

USA . 211 parts In-Stock

1+ parts

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100+ parts

$18.722

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211

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$18.722

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Overview

Elevate your designs with the STCD1020RDG6E from STMicroelectronics, a premier choice in clock drivers and buffers. Crafted for reliability and precision, this compact, surface-mount device excels in industrial applications, ensuring stable performance across diverse environments. With a robust temperature range and minimal power consumption, it empowers your projects while saving on energy costs. Trust in STMicroelectronics' legacy of quality to deliver exceptional value and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern circuit boards.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a variety of input signals and devices, simplifying design requirements.

Package Shape: SQUARE

The square package shape promotes efficient space utilization on PCBs, allowing for high-density layouts.

Nominal Supply Voltage / Vsup: 2.8V

A nominal supply voltage of 2.8V is optimal for low-power applications, enhancing energy efficiency.

Power Supplies (V): 2.8

A consistent power supply of 2.8V supports stable operation within a wide range of applications.

No. of Terminals: 8

With 8 terminals, this product provides ample connectivity options while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile facilitate integration into space-constrained designs, particularly in portable devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating in temperatures as low as -40 °C guarantees functionality in extreme cold conditions, expanding application use cases.

Terminal Finish: MATTE TIN

The matte tin finish improves solderability and corrosion resistance, ensuring reliable performance over time.

Terminal Position: DUAL

Dual terminal positioning supports improved routing options on PCBs, enhancing design flexibility.

Maximum Seated Height: 0.8mm

A low seated height of just 0.8mm helps achieve a sleeker product profile, essential for modern electronics design.

Width: 2mm

At only 2mm wide, this product is optimized for compact applications, providing versatility in design.

Minimum Supply Voltage (Vsup): 2.5V

A minimum supply voltage of 2.5V allows the device to operate in a wider range of power scenarios, increasing its application versatility.

Length: 2mm

The 2mm length ensures the product remains compact while providing sufficient functionality, perfect for small devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies reliability and performance in demanding environments, suitable for industrial applications.

Terminal Form: NO LEAD

No-lead design facilitates environmentally friendly manufacturing processes, aligning with modern sustainability standards.

Terminal Pitch: 0.5mm

A terminal pitch of 0.5mm allows for high density of components on PCBs, crucial in today’s compact electronic devices.

No. of True Outputs: 2

Featuring 2 true outputs enables the delivery of multiple signals, enhancing functionality in a single package.

Maximum Supply Voltage (Vsup): 3.6V

The capability to handle a maximum supply voltage of 3.6V ensures compatibility with higher power applications, providing flexibility to designers.

Technical Specifications

Clock Drivers & Buffers STCD1020RDG6E attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

1020

Input Conditioning:

STANDARD

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Power Supplies (V):

2.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

2.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

STCD1020RDG6E Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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