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STCD1030RDH6E

STMicroelectronics

STCD1030RDH6E by STMicroelectronics

STCD1030RDH6E from STMicroelectronics is a compact clock driver with a 2.8V nominal voltage, operating b/w -40 °C to 85 °C. It features 3 true outputs and comes in a small outline package (2x2.5mm). Ideal for industrial applications requiring precise timing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,668 parts In-Stock

1+ parts

-

100+ parts

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3,668

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Digiode

USA . 3,547 parts In-Stock

1+ parts

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1k+ parts

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3,547

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Anansix

USA . 926 parts In-Stock

1+ parts

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100+ parts

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926

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 258 parts In-Stock

1+ parts

$3.322

100+ parts

-

1k+ parts

$3.189

10k+ parts

$3.189

258

$3.322

-

$3.189

$3.189

IDEA Electronic Components Group

UK . 783 parts In-Stock

1+ parts

$14.133

100+ parts

-

1k+ parts

$12.720

10k+ parts

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783

$14.133

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$12.720

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MKK Technologies

India . 871 parts In-Stock

1+ parts

$26.576

100+ parts

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10k+ parts

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871

$26.576

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DigiPath Technology Company

USA . 871 parts In-Stock

1+ parts

$26.576

100+ parts

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871

$26.576

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Corphita

USA . 4,887 parts In-Stock

1+ parts

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4,887

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Parana Technologies

USA . 958 parts In-Stock

1+ parts

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100+ parts

$16.898

1k+ parts

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958

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$16.898

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Overview

Elevate your designs with the STCD1030RDH6E from STMicroelectronics—a reliable clock driver that ensures precision and efficiency in any application. Renowned for their commitment to quality, STMicroelectronics delivers a product that thrives in industrial environments, offering exceptional performance from -40 °C to 85 °C. Experience the benefits of compact design and low power consumption, making it the perfect choice for innovative electronics that demand reliability without compromise. Upgrade your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material contributes to lightweight and durable construction, enhancing reliability in various environments.

Surface Mount: YES

Surface mount technology allows for efficient PCB space utilization and supports automated assembly processes, making it ideal for modern manufacturing.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of signal conditions, making the device versatile for various applications.

Package Shape: RECTANGULAR

Rectangular packaging optimizes layout on PCBs, allowing for easier integration into compact designs.

Nominal Supply Voltage / Vsup: 2.8 V

The nominal supply voltage of 2.8 V is optimal for low-power applications, ensuring efficient energy consumption without sacrificing performance.

Power Supplies: 2.8 V

Supports a stable power supply at 2.8 V, ideal for battery-powered devices and low-voltage systems, enhancing overall efficiency.

No. of Terminals: 10

Ten terminals provide multiple connection options, allowing for flexibility in circuit designs and improved signal handling.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile facilitate space-saving designs and make it suitable for compact devices in the industrial sector.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C makes this product reliable for high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this device can function effectively in extreme cold, broadening the application range.

Terminal Position: DUAL

Dual terminal positions enhance flexibility in PCB layout and allow for more efficient connections to other components.

Maximum Seated Height: 0.8 mm

A low maximum seated height of 0.8 mm supports slim designs and saves vertical space on the PCB.

Width: 2 mm

At only 2 mm in width, this product is suitable for ultra-compact electronic devices, accommodating space-constrained designs.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage of 2.5 V ensures compatibility with a wide range of power sources, enhancing design flexibility.

Length: 2.5 mm

A small length of 2.5 mm facilitates its integration into compact electronic devices without sacrificing functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grading, this product is built to withstand demanding industrial environments, ensuring longevity and reliability.

Terminal Form: NO LEAD

The no-lead terminal form enhances compatibility with modern soldering methods, reducing the risk of environmental factors affecting performance.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density board designs, increasing the potential for miniaturization in electronics.

No. of True Outputs: 3

Having three true outputs allows for multiple signal paths, providing versatility in applications where multiple outputs are required.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V supports a range of applications while providing enough headroom for optimal operation.

Technical Specifications

Clock Drivers & Buffers STCD1030RDH6E attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

1030

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-N10

Length:

2.5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

10

No. of True Outputs:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

2.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

STCD1030RDH6E Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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