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STCD1040RDM6F

STMicroelectronics

STCD1040RDM6F by STMicroelectronics

STCD1040RDM6F from STMicroelectronics is a compact clock driver with 4 true outputs, operating b/w 2.5V and 3.6V. It features a dual terminal design in a small outline package, suitable for industrial applications with a max temp of 85 °C. Ideal for surface mount technology, it ensures reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,155 parts In-Stock

1+ parts

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5,155

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Digiode

USA . 3,507 parts In-Stock

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3,507

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Anansix

USA . 1,700 parts In-Stock

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1,700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 399 parts In-Stock

1+ parts

$2.493

100+ parts

-

1k+ parts

$2.393

10k+ parts

$2.393

399

$2.493

-

$2.393

$2.393

IDEA Electronic Components Group

UK . 1,302 parts In-Stock

1+ parts

$8.793

100+ parts

-

1k+ parts

$7.914

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-

1,302

$8.793

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$7.914

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Microchip USA

USA . 208 parts In-Stock

1+ parts

$9.622

100+ parts

-

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208

$9.622

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MKK Technologies

India . 841 parts In-Stock

1+ parts

$16.535

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841

$16.535

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DigiPath Technology Company

USA . 841 parts In-Stock

1+ parts

$16.535

100+ parts

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841

$16.535

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AZTECH Wire

Italy . 444 parts In-Stock

1+ parts

$17.640

100+ parts

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444

$17.640

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Ampacity Inc.

Singapore . 453 parts In-Stock

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$50.000

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453

$50.000

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Component Stockers USA

USA . 544 parts In-Stock

1+ parts

$99.990

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544

$99.990

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Metaverse IC Inc.

Canada . 14,900 parts In-Stock

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14,900

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Perfect Parts

USA . 11,291 parts In-Stock

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11,291

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A-Z Elektronik GmbH

Germany . 5,190 parts In-Stock

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5,190

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Corphita

USA . 3,583 parts In-Stock

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3,583

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QUARKTWIN TECHNOLOGY LTD

USA . 2,290 parts In-Stock

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2,290

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Authorized Procurement Solutions

USA . 595 parts In-Stock

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595

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Parana Technologies

USA . 253 parts In-Stock

1+ parts

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100+ parts

$10.514

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253

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$10.514

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Overview

Unlock the potential of your electronic designs with the STCD1040RDM6F from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers unmatched reliability in clock drivers and buffers. This compact solution ensures precise timing across a variety of applications, from industrial automation to consumer electronics. Enjoy enhanced performance, lower power consumption, and superior durability—all backed by a trusted industry leader. Elevate your projects with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection from environmental factors, making the clock driver reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for smaller and more efficient circuit designs, making it easier to integrate into modern electronics.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a variety of input signals, increasing versatility in applications.

Package Shape: RECTANGULAR

The rectangular shape allows for effective use of space on a PCB, optimizing layout and reducing footprint.

Nominal Supply Voltage / Vsup: 2.8 V

This nominal voltage strikes a balance between low power consumption and sufficient performance, making it energy-efficient.

Power Supplies (V): 2.8

Uniform power supply requirement simplifies design considerations and improves compatibility with existing systems.

No. of Terminals: 12

Having 12 terminals allows for more functionalities and connectivity options within the same device.

Package Style (Meter): SMALL OUTLINE

The small outline package style is suited for space-constrained applications, making it ideal for portable devices.

Maximum Operating Temperature: 85 °C

This high maximum temperature ensures reliable operation in demanding environments, increasing product resilience.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this clock driver is suitable for extreme conditions, broadening application range.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish enhances conductivity and provides corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, optimizing design for various configurations.

Maximum Seated Height: 0.8 mm

A low seated height enables more compact designs and contributes to the overall slim profile of the product.

Width: 2 mm

The narrow width is advantageous for high-density PCB layouts, particularly in portable electronics.

Minimum Supply Voltage (Vsup): 2.5 V

Operating at a minimum of 2.5 V facilitates integration with low-voltage systems, enhancing compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds provides flexibility during assembly without compromising the integrity of the device.

Peak Reflow Temperature °C: 260

This peak reflow temperature allows it to withstand certain soldering processes, ensuring suitability for automated assembly.

Length: 3 mm

The compact length contributes to overall space efficiency in designs, allowing for a smaller product footprint.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies its capability to operate reliably in harsh conditions, making it suitable for various applications.

Terminal Form: GULL WING

Also known for ease of soldering, gull wing terminals provide a reliable connection and are advantageous for automated assembly.

Terminal Pitch: 0.5 mm

With a 0.5 mm terminal pitch, this product supports high-density designs, ideal for modern electronic applications.

No. of True Outputs: 4

Four true outputs allow for multiple clock signals, providing versatility in designs requiring multiple clock sources.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V enables the device to support a wide range of operational needs, adding to its flexibility.

Technical Specifications

Clock Drivers & Buffers STCD1040RDM6F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

1040

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

12

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC12,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

2.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

STCD1040RDM6F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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