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STCD1040PDM6F

STMicroelectronics

STCD1040PDM6F by STMicroelectronics

STCD1040PDM6F by STMicroelectronics is a clock driver in a small outline package with 12 terminals. It operates at industrial temperature range of -40 to 85 °C, with nominal voltage of 1.8V. Ideal for surface mount applications requiring precise clock signal distribution.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,718 parts In-Stock

1+ parts

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3,718

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Anansix

USA . 2,877 parts In-Stock

1+ parts

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2,877

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Vyrian

USA . 1,842 parts In-Stock

1+ parts

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1,842

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 25 parts In-Stock

1+ parts

$4.739

100+ parts

-

1k+ parts

$4.549

10k+ parts

$4.549

25

$4.739

-

$4.549

$4.549

IDEA Electronic Components Group

UK . 241 parts In-Stock

1+ parts

$7.745

100+ parts

-

1k+ parts

$6.970

10k+ parts

-

241

$7.745

-

$6.970

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MKK Technologies

India . 1,722 parts In-Stock

1+ parts

$14.563

100+ parts

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1,722

$14.563

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DigiPath Technology Company

USA . 1,722 parts In-Stock

1+ parts

$14.563

100+ parts

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1,722

$14.563

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Parana Technologies

USA . 2,186 parts In-Stock

1+ parts

-

100+ parts

$9.260

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2,186

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$9.260

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Corphita

USA . 1,015 parts In-Stock

1+ parts

-

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1,015

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Overview

Enhance your electronic designs with the STCD1040PDM6F by STMicroelectronics, a top-tier clock driver and buffer that promises unmatched quality and reliability. Crafted by the renowned manufacturer STMicroelectronics, this product offers a wide range of applications and benefits that cater to all your needs. From its innovative design to its superior performance, this clock driver is a game-changer in the industry. Trust in STMicroelectronics to deliver cutting-edge technology that amplifies your projects and brings value to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and enabling mass production.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy-efficient and suitable for low power applications.

No. of Terminals: 12

Offers multiple terminals for connecting to various components, expanding the functionality and versatility of the product.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, making it suitable for a wide range of temperature conditions.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, where durability and reliability are crucial.

Technical Specifications

Clock Drivers & Buffers STCD1040PDM6F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-N12

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC12,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

STCD1040PDM6F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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