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STCD23100F35F

STMicroelectronics

STCD23100F35F by STMicroelectronics

STCD23100F35F from STMicroelectronics is a compact clock driver with a 6 ns propagation delay and operates b/w 2.5 V to 5.1 V. It features an open-drain output and supports up to 4 true outputs, ideal for high-speed applications in tight spaces. Its thin profile design ensures efficient use in modern electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,939 parts In-Stock

1+ parts

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3,939

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Digiode

USA . 1,736 parts In-Stock

1+ parts

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1,736

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Anansix

USA . 1,366 parts In-Stock

1+ parts

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1,366

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 418 parts In-Stock

1+ parts

$7.550

100+ parts

-

1k+ parts

$7.248

10k+ parts

$7.248

418

$7.550

-

$7.248

$7.248

IDEA Electronic Components Group

UK . 674 parts In-Stock

1+ parts

$26.835

100+ parts

-

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$24.152

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674

$26.835

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$24.152

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MKK Technologies

India . 1,877 parts In-Stock

1+ parts

$50.462

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1,877

$50.462

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DigiPath Technology Company

USA . 1,877 parts In-Stock

1+ parts

$50.462

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1,877

$50.462

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Corphita

USA . 310 parts In-Stock

1+ parts

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310

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Parana Technologies

USA . 61 parts In-Stock

1+ parts

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$32.086

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61

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$32.086

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Overview

Unlock precision and reliability with the STCD23100F35F from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality clock driver excels in performance across various applications, ensuring seamless signal integrity for your designs. With its compact, thin-profile package and robust operating range, it offers exceptional value to engineers looking for efficiency and durability. Experience the difference with STMicroelectronics, where quality meets cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and resistance to environmental factors, enhancing the lifespan of the product.

Surface Mount: YES

Surface mount technology allows for compact designs and improved circuit density, making it suitable for modern electronics.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of signals, simplifying integration into different systems.

Package Shape: RECTANGULAR

The rectangular shape helps optimize PCB layout and space usage, facilitating better design flexibility.

Nominal Supply Voltage / Vsup: 3.8 V

Operating at a nominal voltage of 3.8 V offers a good balance between performance and power consumption.

No. of Terminals: 12

The 12 terminals provide ample connections for robust functionality and enable versatile application in circuit designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style allows for high-density mounting and ease of soldering, making it ideal for space-constrained applications.

Propagation Delay (tpd): 6 ns

A low propagation delay ensures fast signal transmission, which is critical for high-speed applications.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C makes this product suitable for a wide range of industrial and consumer applications.

Output Characteristics: OPEN-DRAIN

Open-drain output configuration allows for simple wired-AND logic functions and interoperability with various devices.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20 °C, this product is reliable in colder environments, broadening its application range.

Terminal Position: BOTTOM

Bottom terminal positioning aids in efficient heat dissipation and optimal placement on PCBs.

Maximum Seated Height: 0.66 mm

A low seated height supports compact designs, allowing more components to be placed in close proximity.

Width: 1.2 mm

The narrow width facilitates tight layouts and dense circuit designs, which is advantageous in miniaturized electronics.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage of 2.5 V supports low-power applications while maintaining functionality.

Length: 1.6 mm

A compact length makes it suitable for use in small electronic assemblies, contributing to overall space efficiency.

Terminal Form: BALL

Ball terminal form enhances reliability during soldering, ensuring solid connections in challenging environments.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for high-density arrangements, maximizing the use of available space on circuit boards.

No. of True Outputs: 4

Having 4 true outputs enables the driving of multiple loads simultaneously, increasing functionality in various applications.

Maximum Supply Voltage (Vsup): 5.1 V

With a maximum supply voltage of 5.1 V, the product is suitable for a wide array of applications requiring varying voltage levels.

Technical Specifications

Clock Drivers & Buffers STCD23100F35F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

2310

Input Conditioning:

STANDARD

JESD-30 Code:

R-PBGA-B12

Length:

1.6 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

12

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

.66 mm

Maximum Supply Voltage (Vsup):

5.1 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.2 mm

Trade Compliance

STCD23100F35F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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