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STCD23200F35F

STMicroelectronics

STCD23200F35F by STMicroelectronics

STCD23200F35F from STMicroelectronics is a versatile clock driver with a 3.8V nominal supply and 6 ns propagation delay. It features an open-drain output and operates in temperatures from -20 °C to 85°C, ideal for compact electronic applications. Its thin profile and fine pitch make it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,517 parts In-Stock

1+ parts

-

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2,517

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Vyrian

USA . 1,476 parts In-Stock

1+ parts

-

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1,476

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Digiode

USA . 649 parts In-Stock

1+ parts

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649

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 49 parts In-Stock

1+ parts

$3.486

100+ parts

-

1k+ parts

$3.347

10k+ parts

$3.347

49

$3.486

-

$3.347

$3.347

IDEA Electronic Components Group

UK . 1,631 parts In-Stock

1+ parts

$18.459

100+ parts

-

1k+ parts

$16.613

10k+ parts

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1,631

$18.459

-

$16.613

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MKK Technologies

India . 877 parts In-Stock

1+ parts

$34.711

100+ parts

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877

$34.711

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DigiPath Technology Company

USA . 877 parts In-Stock

1+ parts

$34.711

100+ parts

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877

$34.711

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Corphita

USA . 2,858 parts In-Stock

1+ parts

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2,858

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Parana Technologies

USA . 753 parts In-Stock

1+ parts

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100+ parts

$22.070

1k+ parts

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753

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$22.070

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Overview

Unlock unparalleled precision and reliability with the STCD23200F35F from STMicroelectronics—your go-to solution for clock driving and buffering needs. Renowned for their commitment to quality, STMicroelectronics delivers cutting-edge technology that enhances performance in diverse applications, from telecommunications to consumer electronics. Experience reduced latency, superior thermal management, and design flexibility that empowers your innovations, all while enjoying the trusted support of a global leader in semiconductor solutions. Elevate your projects with this high-performance component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body offers durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller circuit designs and easier assembly, enhancing production efficiency.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, reducing design complexity.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCBs, making it easier to integrate into various layouts.

Nominal Supply Voltage / Vsup: 3.8V

A nominal supply voltage of 3.8V allows for reliable operation in low-power applications, ideal for battery-powered devices.

No. of Terminals: 12

Having 12 terminals provides sufficient connectivity options for multiple functions, enhancing the device's versatility.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array, very thin profile, and fine pitch design facilitate advanced miniaturization, beneficial for compact electronics.

Propagation Delay (tpd): 6 ns

A low propagation delay of 6 ns ensures fast signal transmission, improving overall circuit performance in high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is suitable for high-temperature environments without performance degradation.

Output Characteristics: OPEN-DRAIN

Open-drain output characteristics allow for versatile interfacing with multiple components, supporting a variety of circuit topologies.

Minimum Operating Temperature: -20 °C

The product's operating temperature range down to -20 °C ensures reliable performance in colder environments, expanding application scope.

Terminal Position: BOTTOM

Bottom terminal positioning aids in effective thermal management and facilitates compact device layouts.

Maximum Seated Height: 0.66 mm

A maximum seated height of only 0.66 mm contributes to a low-profile design, important for space-constrained applications.

Width: 1.2 mm

The small width of 1.2 mm allows for increased density on PCBs, making it an excellent choice for advanced miniaturized devices.

Minimum Supply Voltage (Vsup): 2.5V

A minimum supply voltage of 2.5V enables operation in low-voltage applications, enhancing efficiency and battery life.

Length: 1.6 mm

The compact length of 1.6 mm helps in creating more densely packed circuit boards, suitable for modern electronic designs.

Terminal Form: BALL

Ball terminals provide reliable solder connections, ensuring robustness and longevity in physical and thermal stress conditions.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm allows for high-density mounting on PCBs, facilitating the design of more compact and efficient devices.

No. of True Outputs: 4

Having 4 true outputs provides ample functionality for diverse circuits, making this product suitable for complex designs.

Maximum Supply Voltage (Vsup): 5.1V

A maximum supply voltage of 5.1V gives flexibility for operation across a range of power supply levels, adapting to various applications.

Technical Specifications

Clock Drivers & Buffers STCD23200F35F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

2320

Input Conditioning:

STANDARD

JESD-30 Code:

R-PBGA-B12

Length:

1.6 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

12

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

.66 mm

Maximum Supply Voltage (Vsup):

5.1 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.2 mm

Trade Compliance

STCD23200F35F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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