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STCD2300F35F

STMicroelectronics

STCD2300F35F by STMicroelectronics

STCD2300F35F by STMicroelectronics is a clock driver with 3/5V power supplies, 12 terminals, and operates b/w -20 to 85 °C. It comes in a plastic package with surface mount feature. Ideal for applications requiring precise clock signal distribution in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,860

-

-

-

-

Vyrian

USA . 2,728 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,728

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-

-

-

Anansix

USA . 2,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,060

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 305 parts In-Stock

1+ parts

$4.723

100+ parts

-

1k+ parts

$4.534

10k+ parts

$4.534

305

$4.723

-

$4.534

$4.534

IDEA Electronic Components Group

UK . 1,641 parts In-Stock

1+ parts

$12.771

100+ parts

-

1k+ parts

$11.493

10k+ parts

-

1,641

$12.771

-

$11.493

-

MKK Technologies

India . 2,350 parts In-Stock

1+ parts

$24.014

100+ parts

-

1k+ parts

-

10k+ parts

-

2,350

$24.014

-

-

-

DigiPath Technology Company

USA . 2,350 parts In-Stock

1+ parts

$24.014

100+ parts

-

1k+ parts

-

10k+ parts

-

2,350

$24.014

-

-

-

Corphita

USA . 4,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,075

-

-

-

-

Parana Technologies

USA . 641 parts In-Stock

1+ parts

-

100+ parts

$15.269

1k+ parts

-

10k+ parts

-

641

-

$15.269

-

-

Overview

Elevate your electronic designs with the STCD2300F35F clock driver and buffer from STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics offers cutting-edge solutions for a wide range of applications in the clock drivers & buffers category. This versatile product is designed to optimize performance and efficiency, delivering value and benefits to customers looking for seamless integration and precision timing in their projects. Trust STMicroelectronics to provide you with the tools you need to bring your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring the durability and reliability of the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on a printed circuit board, saving space and facilitating automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to design the layout of the PCB and integrate the clock driver seamlessly within the system.

Power Supplies (V): 3/5

Having the option for multiple power supply voltages (3V and 5V) provides flexibility in compatibility with different systems and components.

No. of Terminals: 12

Having a sufficient number of terminals allows for connectivity with other components and peripherals, enhancing the functionality of the clock driver.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design facilitate high-density integration on the PCB, enabling compact and efficient circuit layouts.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the clock driver can function reliably even in elevated temperature environments, increasing its versatility.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows the clock driver to operate efficiently in cold conditions without performance degradation.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the PCB layout and facilitates easier connections with other components.

Terminal Form: BALL

Ball terminals provide a secure and reliable connection with the PCB, reducing the risk of intermittent connections or signal loss.

Terminal Pitch: 0.4 mm

The small terminal pitch enables compact design and high-density mounting on the PCB, contributing to space-saving and improved signal integrity.

Technical Specifications

Clock Drivers & Buffers STCD2300F35F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B12

Logic IC Type:

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

STCD2300F35F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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