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STCD22000F35F

STMicroelectronics

STCD22000F35F by STMicroelectronics

STCD22000F35F from STMicroelectronics is a versatile clock driver with a 3.8V nominal voltage, 6 ns propagation delay, and operates in temperatures from -20 °C to 85°C. Its compact design features a very thin profile and fine pitch for efficient surface mounting. Ideal for high-speed applications requiring precise timing control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,407 parts In-Stock

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4,407

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Vyrian

USA . 3,158 parts In-Stock

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3,158

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Anansix

USA . 785 parts In-Stock

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785

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,008 parts In-Stock

1+ parts

$16.616

100+ parts

-

1k+ parts

$14.955

10k+ parts

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1,008

$16.616

-

$14.955

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MKK Technologies

India . 34 parts In-Stock

1+ parts

$31.246

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34

$31.246

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DigiPath Technology Company

USA . 34 parts In-Stock

1+ parts

$31.246

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34

$31.246

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Corphita

USA . 4,913 parts In-Stock

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4,913

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Parana Technologies

USA . 1,293 parts In-Stock

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$19.867

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1,293

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$19.867

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Overview

Unlock unparalleled precision and performance with the STCD22000F35F from STMicroelectronics. This top-tier clock driver excels in delivering reliable timing solutions for a range of applications, from consumer electronics to industrial systems. With its ultra-thin profile and robust design, it ensures seamless integration and high efficiency. Trust in STMicroelectronics' legacy of innovation and quality to elevate your projects, maximizing value and reliability for every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern circuit boards.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, enhancing versatility.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for more efficient layout and design.

Nominal Supply Voltage / Vsup: 3.8 V

A nominal supply voltage of 3.8 V is ideal for low-power applications while providing stable performance.

No. of Terminals: 12

With 12 terminals, this device offers multiple connectivity options for flexible circuit design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style provides a very thin profile and fine pitch, suitable for high-density designs.

Propagation Delay (tpd): 6 ns

A fast propagation delay of 6 ns ensures quick signal transmission, enhancing the overall system performance.

Maximum Operating Temperature: 85 °C

With an operating temperature of up to 85 °C, this component can function effectively in various environments.

Output Characteristics: OPEN-DRAIN

Open-drain output characteristics allow for easy interfacing with other devices and logic levels.

Minimum Operating Temperature: -20 °C

Low operating temperature range makes it suitable for applications in harsh environments.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier soldering and improved thermal performance.

Maximum Seated Height: 0.66 mm

A low seated height keeps the overall design compact and suitable for space-constrained applications.

Width: 1.2 mm

Narrow width allows for greater flexibility in board layout and component placement.

Minimum Supply Voltage (Vsup): 2.5 V

A minimum supply voltage of 2.5 V ensures compatibility with a range of power sources.

Length: 1.6 mm

Short length contributes to overall compact design, enabling easier integration into tight spaces.

Terminal Form: BALL

Ball terminal form enhances solderability and improves electrical connection reliability.

Terminal Pitch: 0.4 mm

A fine terminal pitch allows for higher density connections, maximizing circuit board real estate.

No. of True Outputs: 4

Four true outputs provide flexibility for various output configurations and applications.

Maximum Supply Voltage (Vsup): 5.1 V

A maximum supply voltage of 5.1 V extends the range of applications where this product can be utilized.

Technical Specifications

Clock Drivers & Buffers STCD22000F35F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

2200

Input Conditioning:

STANDARD

JESD-30 Code:

R-PBGA-B12

Length:

1.6 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

12

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

.66 mm

Maximum Supply Voltage (Vsup):

5.1 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.2 mm

Trade Compliance

STCD22000F35F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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