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STCD23300F35F

STMicroelectronics

STCD23300F35F by STMicroelectronics

STCD23300F35F from STMicroelectronics is a compact clock driver with a 3.8V nominal voltage and a low propagation delay of 6 ns. It features an open-drain output and operates in temperatures from -20 °C to 85°C. Ideal for high-speed applications, it supports surface mount technology in a very thin profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,856 parts In-Stock

1+ parts

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4,856

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Anansix

USA . 2,098 parts In-Stock

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2,098

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Vyrian

USA . 85 parts In-Stock

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85

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 628 parts In-Stock

1+ parts

$13.562

100+ parts

-

1k+ parts

$12.206

10k+ parts

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628

$13.562

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$12.206

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MKK Technologies

India . 1,730 parts In-Stock

1+ parts

$25.502

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1,730

$25.502

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DigiPath Technology Company

USA . 1,730 parts In-Stock

1+ parts

$25.502

100+ parts

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1,730

$25.502

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Corphita

USA . 4,107 parts In-Stock

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4,107

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Parana Technologies

USA . 873 parts In-Stock

1+ parts

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$16.215

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873

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$16.215

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Overview

Unlock precision and reliability with the STCD23300F35F clock driver from STMicroelectronics. Renowned for their commitment to innovation and quality, STMicroelectronics delivers this compact, efficient solution perfect for modern electronic applications. With its ultra-low propagation delay and robust performance in diverse environments, it ensures seamless operation whether in automotive systems or consumer electronics, providing exceptional value and peace of mind for your projects. Experience the difference with ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to moisture, making it suitable for a wide range of environments.

Surface Mount: YES

Surface mount technology allows for lower profile designs and efficient automated assembly, making it ideal for modern compact electronics.

Input Conditioning: STANDARD

Standard input conditioning supports compatibility with various input signals, making the product versatile for different applications.

Package Shape: RECTANGULAR

The rectangular shape simplifies PCB layout and maximizes board space utilization, promoting efficient design in tight spaces.

Nominal Supply Voltage / Vsup: 3.8 V

Operating around a nominal supply voltage ensures optimal performance while maintaining power efficiency in low-voltage applications.

No. of Terminals: 12

A higher number of terminals allows for increased connectivity options, enhancing the integration of the device into complex circuits.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style reduces the footprint and maximizes thermal performance, making it suitable for space-constrained applications.

Propagation Delay (tpd): 6 ns

A low propagation delay indicates fast signal transmission, which is crucial for high-speed applications requiring quick response times.

Maximum Operating Temperature: 85 °C

Operating at high temperatures ensures reliability in demanding environments, making it suitable for industrial applications.

Output Characteristics: OPEN-DRAIN

Open-drain outputs provide flexibility in interfacing with various logic levels and enable wired-AND configurations, enhancing circuit design options.

Minimum Operating Temperature: -20 °C

A wide temperature range allows operation in diverse environmental conditions, ideal for both indoor and outdoor applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient thermal management and improved electrical performance in compact designs.

Maximum Seated Height: 0.66 mm

The low seated height allows for ultra-thin designs, making it perfect for modern, portable electronic devices.

Width: 1.2 mm

A narrow width contributes to compact design solutions, allowing for high-density PCB layouts.

Minimum Supply Voltage (Vsup): 2.5 V

Operating down to a low supply voltage enables energy-efficient designs in battery-powered applications.

Length: 1.6 mm

The short length ensures minimal space usage on the PCB, allowing for more components in a limited area.

Terminal Form: BALL

Ball terminals provide good solderability and reliability in surface mount applications, enhancing connection integrity.

Terminal Pitch: 0.4 mm

A fine terminal pitch enables higher integration density, supporting advanced electronic designs with more functionality.

No. of True Outputs: 4

Multiple outputs provide the capability to drive several signals concurrently, making it versatile for multi-channel applications.

Maximum Supply Voltage (Vsup): 5.1 V

The upper limit of the supply voltage allows for flexibility when interfacing with various systems and reduces power supply constraints.

Technical Specifications

Clock Drivers & Buffers STCD23300F35F attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

2330

Input Conditioning:

STANDARD

JESD-30 Code:

R-PBGA-B12

Length:

1.6 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

12

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

.66 mm

Maximum Supply Voltage (Vsup):

5.1 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.2 mm

Trade Compliance

STCD23300F35F Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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