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74V1T126CTR

STMicroelectronics

74V1T126CTR by STMicroelectronics

74V1T126CTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 8.5 ns, operating b/w -55 °C to 125°C. It features a compact SOIC package and supports dual ports with 3-state output. Ideal for high-speed data transmission in military applications.

Median Price

$0.760

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 2,925 parts In-Stock

1+ parts

$0.760

100+ parts

$0.798

1k+ parts

$0.752

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-

2,925

$0.760

$0.798

$0.752

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ComSIT Distribution GmbH

Germany . 17,815 parts In-Stock

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Odintec Ltd.

Israel . 9,000 parts In-Stock

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Vyrian

USA . 6,860 parts In-Stock

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PC Components Company LLC

USA . 2,720 parts In-Stock

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2,720

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Bristol Electronics

USA . 2,720 parts In-Stock

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2,720

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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2,500

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Digiode

USA . 2,298 parts In-Stock

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Anansix

USA . 825 parts In-Stock

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825

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Distributors (Availability)

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Microchip USA

USA . 485 parts In-Stock

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$7.250

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485

$7.250

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Andel Nordic

Denmark . 4,311 parts In-Stock

1+ parts

$9.669

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$9.283

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$9.283

4,311

$9.669

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$9.283

$9.283

AZTECH Wire

Italy . 1,015 parts In-Stock

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$13.540

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1,015

$13.540

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IDEA Electronic Components Group

UK . 2,319 parts In-Stock

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$14.313

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$12.882

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2,319

$14.313

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$12.882

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Native Components

USA . 568 parts In-Stock

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$16.880

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568

$16.880

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Northwest PG Solutions

USA . 2,060 parts In-Stock

1+ parts

$18.568

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$16.711

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2,060

$18.568

$16.711

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$20.441

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$18.601

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$16.762

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$20.441

$18.601

$16.762

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MKK Technologies

India . 388 parts In-Stock

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$26.915

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388

$26.915

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DigiPath Technology Company

USA . 388 parts In-Stock

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$26.915

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388

$26.915

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Corohmni

South Africa . 140 parts In-Stock

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$31.827

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140

$31.827

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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Corphita

USA . 2,645 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,500 parts In-Stock

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2,500

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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2,000

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Parana Technologies

USA . 1,617 parts In-Stock

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$17.114

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1,617

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$17.114

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Overview

Elevate your designs with the 74V1T126CTR from STMicroelectronics, a trusted name in innovation. This high-performance bus driver and transceiver ensures lightning-fast communication with an ultra-low propagation delay of just 8.5 ns, making it perfect for demanding applications in automotive and industrial sectors. Its compact, robust design guarantees thermal stability and reliability, empowering engineers to push boundaries while enjoying the quality assurance that comes with STMicroelectronics' reputation. Experience seamless integration and superior functionality today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a durable and lightweight package, making it suitable for various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay ensures high-speed data transfer, making this product ideal for fast communication systems.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to place and align with standard PCB layouts.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal supply voltage of 5V makes it compatible with most digital circuits.

Load Capacitance (CL): 50 pF

A lower load capacitance results in improved performance with faster signal transitions.

Power Supplies (V): 5

The compatibility with 5V power supplies simplifies integration into existing designs.

No. of Terminals: 5

Having 5 terminals allows for versatile connectivity options for different configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style enables high-density packaging, ideal for space-constrained applications.

Maximum I (ol): 8 Amp

With a maximum output current of 8A, this device can drive significant loads, enhancing its versatility.

Propagation Delay (tpd): 8.5 ns

Consistent propagation delay ensures that performance specifications are reliable in high-speed applications.

Maximum Operating Temperature: 125 °C

A high operating temperature range allows this product to function in demanding environments.

Output Characteristics: 3-STATE

3-state output characteristic enables efficient bus communication without conflicts, ideal for shared data lines.

Minimum Operating Temperature: -55 °C

Low temperature operation makes this device suitable for use in extreme conditions and military applications.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides good solderability and helps prevent tarnishing, improving reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options on PCBs.

No. of Ports: 2

Having two ports facilitates bi-directional communication, suitable for a variety of applications.

Maximum Seated Height: 1.1 mm

A slim profile at 1.1 mm makes it suitable for low-profile designs.

Width: 1.25 mm

Narrow width allows for compact integration into high-density electronic devices.

Output Polarity: TRUE

True output polarity simplifies design considerations and ensures compatibility with standard logic families.

Minimum Supply Voltage (Vsup): 4.5 V

The device operates at a minimum supply voltage of 4.5V for better compatibility with various power supply systems.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures reliable solder connections during assembly.

Peak Reflow Temperature °C: 260

Withstanding a peak reflow temperature of 260 °C guarantees durability during manufacturing processes.

Length: 2 mm

The compact length enhances the application in space-constrained settings.

Temperature Grade: MILITARY

A military temperature grade signifies robustness and reliability for use in mission-critical applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form eases soldering and increases mechanical strength in connections.

Packing Method: TR

Tape and reel packing method facilitates automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density layouts without sacrificing performance.

Control Type: ENABLE HIGH

The enable high control type simplifies the logic of enabling the device in circuits.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum voltage of 5.5V provides a safety margin over the nominal voltage, ensuring reliability.

Technical Specifications

Bus Driver & Transceivers 74V1T126CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1T126CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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