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74V1G384STR

STMicroelectronics

74V1G384STR by STMicroelectronics

74V1G384STR by STMicroelectronics is a low-profile CMOS bus driver with a 3.3V nominal supply and 2 ns propagation delay. It operates in extreme temperatures from -55 °C to 125°C, making it ideal for military applications. Its compact design features dual ports and a gull-wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,783 parts In-Stock

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5,783

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Anansix

USA . 2,002 parts In-Stock

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2,002

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Digiode

USA . 1,244 parts In-Stock

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1,244

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 151 parts In-Stock

1+ parts

$0.447

100+ parts

-

1k+ parts

-

10k+ parts

$0.430

151

$0.447

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$0.430

Northwest PG Solutions

USA . 627 parts In-Stock

1+ parts

$0.492

100+ parts

-

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-

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$0.434

627

$0.492

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$0.434

AZTECH Wire

Italy . 720 parts In-Stock

1+ parts

$8.270

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720

$8.270

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Andel Nordic

Denmark . 575 parts In-Stock

1+ parts

$11.446

100+ parts

-

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$10.988

10k+ parts

$10.988

575

$11.446

-

$10.988

$10.988

IDEA Electronic Components Group

UK . 1,024 parts In-Stock

1+ parts

$26.395

100+ parts

-

1k+ parts

$23.755

10k+ parts

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1,024

$26.395

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$23.755

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Microchip USA

USA . 208 parts In-Stock

1+ parts

$34.749

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208

$34.749

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MKK Technologies

India . 1,578 parts In-Stock

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$49.634

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1,578

$49.634

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DigiPath Technology Company

USA . 1,578 parts In-Stock

1+ parts

$49.634

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1,578

$49.634

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Assy Fe

Spain . 6,000 parts In-Stock

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6,000

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Parana Technologies

USA . 1,103 parts In-Stock

1+ parts

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$31.559

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1,103

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$31.559

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Corphita

USA . 1,069 parts In-Stock

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1,069

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Overview

Elevate your designs with the 74V1G384STR from STMicroelectronics, a trusted leader in semiconductor solutions. This versatile bus driver and transceiver delivers exceptional performance with ultra-fast propagation delay and outstanding thermal stability, ensuring reliability in demanding applications. Ideal for automotive, industrial, or consumer electronics, it simplifies your design process while enhancing efficiency and robustness. Choose quality and innovation that lasts—choose STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, enhancing overall space efficiency.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for efficient space utilization and fitting into standard layouts.

Nominal Supply Voltage / Vsup: 3.3V

Designed for a nominal supply voltage of 3.3V, this product is compatible with a wide range of low-power applications.

Power Supplies: 3.3/5V

Dual power supply options (3.3V and 5V) enhance flexibility, allowing it to function in various system configurations.

No. of Terminals: 5

With 5 terminals, this product offers sufficient connectivity while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design allow for better performance in space-constrained applications.

Propagation Delay (tpd): 2 ns

A fast propagation delay of 2 ns ensures high-speed data transfer, making it ideal for applications requiring rapid response times.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating (125 °C) makes this product suitable for demanding and harsh environments.

Output Characteristics: 3-STATE

3-state output characteristics provide flexibility for bus systems, allowing multiple devices to share the same communication lines.

Minimum Operating Temperature: -55 °C

The wide temperature range down to -55 °C ensures reliable operation in frigid conditions, making it suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish of nickel palladium gold offers excellent corrosion resistance and enhances solderability, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position design aids in better signal integrity and improves connection options on circuits.

No. of Ports: 2

Having 2 ports allows for versatile connections in various systems, enhancing its usability in multiple scenarios.

Maximum Seated Height: 1.45 mm

The low seated height of just 1.45 mm allows it to fit into low-profile designs without compromising performance.

Width: 1.625 mm

With a compact width of 1.625 mm, this product maximizes space efficiency in chip layouts.

Output Polarity: TRUE

TRUE output polarity is beneficial for logic compatibility in most digital circuits, ensuring reliable performance.

Minimum Supply Voltage (Vsup): 3V

The minimum supply voltage of 3V allows the component to be used in low-voltage applications, enhancing power efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time at peak reflow temperature of 30 seconds ensures safe soldering processes without damaging the device.

Peak Reflow Temperature °C: 260 °C

The peak reflow temperature of 260 °C allows for compatibility with standard soldering processes, ensuring effective assembly.

Length: 2.9 mm

Its compact length of 2.9 mm makes this product ideal for space-constrained applications, promoting more efficient layouts.

Temperature Grade: MILITARY

The military temperature grade ensures reliability and robustness for defense and aerospace applications, meeting stringent standards.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, enhancing efficiency in electronic designs.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and efficient mounting to PCBs, improving assembly processes.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for high-density arrangements in PCB designs, maximizing space utilization.

Maximum Supply Voltage (Vsup): 5.5V

With a maximum supply voltage of 5.5V, this component supports a wide range of operating conditions for various applications.

Technical Specifications

Bus Driver & Transceivers 74V1G384STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74V1G384STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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