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74V1G70C

STMicroelectronics

74V1G70C by STMicroelectronics

74V1G70C by STMicroelectronics is a bus driver with 9.2 ns propagation delay, suitable for industrial applications. It operates at a supply voltage range of 2-5.5 V, has a load capacitance of 50 pF, and features dual terminal position with gull wing form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,793 parts In-Stock

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Anansix

USA . 1,332 parts In-Stock

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1,332

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Digiode

USA . 1,207 parts In-Stock

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1,207

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 411 parts In-Stock

1+ parts

$1.306

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411

$1.306

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Northwest PG Solutions

USA . 1,678 parts In-Stock

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$1.437

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$1.437

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Andel Nordic

Denmark . 5,160 parts In-Stock

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$1.558

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$1.496

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$1.496

5,160

$1.558

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$1.496

$1.496

IDEA Electronic Components Group

UK . 850 parts In-Stock

1+ parts

$28.271

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$25.444

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850

$28.271

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$25.444

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MKK Technologies

India . 2,222 parts In-Stock

1+ parts

$53.161

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2,222

$53.161

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DigiPath Technology Company

USA . 2,222 parts In-Stock

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$53.161

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$53.161

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Corphita

USA . 1,555 parts In-Stock

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1,555

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Parana Technologies

USA . 1,019 parts In-Stock

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$33.802

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1,019

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$33.802

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Overview

Elevate your electronic designs with the 74V1G70C from STMicroelectronics, a leading manufacturer known for top-quality components. This bus driver and transceiver offers lightning-fast propagation delay, ensuring efficient signal transmission in a compact package. Ideal for industrial applications, this versatile component operates within a wide range of temperatures and voltages. Trust STMicroelectronics to deliver reliable solutions that enhance performance and functionality, setting your project apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 9.2 ns

Low propagation delay ensures fast and efficient communication between devices, ideal for high-performance applications.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it versatile and suitable for a wide range of applications.

Load Capacitance (CL): 50 pF

Optimized for working with typical load capacitance values, ensuring stable and reliable operation.

Power Supplies (V): 2/5.5

Can operate within a wide range of power supply voltages, offering flexibility in various system configurations.

No. of Terminals: 5

Offers sufficient connectivity options for interconnecting with other components in a bus driver or transceiver circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-saving design that is suitable for compact electronic devices and applications with limited space.

Maximum I (ol): 4 Amp

High output current capability allows for driving multiple loads or devices without the need for additional buffers.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, providing reliability in various operating conditions.

Terminal Finish: TIN LEAD

Provides good conductivity and solderability, ensuring reliable connections and easy assembly.

Technology: CMOS

Utilizes CMOS technology for low power consumption, making it energy-efficient and suitable for battery-powered devices.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on PCBs, making it suitable for applications with space constraints.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher supply voltages, offering flexibility for use in different power supply configurations.

Technical Specifications

Bus Driver & Transceivers 74V1G70C attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

74

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.2 ns

Propagation Delay (tpd):

9.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V1G70C Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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