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74V1T384CTR

STMicroelectronics

74V1T384CTR by STMicroelectronics

74V1T384CTR by STMicroelectronics is a CMOS bus driver with a 5V nominal supply and operates in extreme temperatures from -55 °C to 125°C. It features a fast propagation delay of just 2 ns and supports dual ports with 3-state output. Ideal for military applications, it comes in a compact SOIC package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,961 parts In-Stock

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1,961

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Digiode

USA . 1,918 parts In-Stock

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Vyrian

USA . 227 parts In-Stock

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227

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Distributors (Availability)

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Andel Nordic

Denmark . 1,201 parts In-Stock

1+ parts

$3.385

100+ parts

-

1k+ parts

$3.250

10k+ parts

$3.250

1,201

$3.385

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$3.250

$3.250

Native Components

USA . 322 parts In-Stock

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$12.535

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322

$12.535

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Northwest PG Solutions

USA . 1,935 parts In-Stock

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$13.789

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$12.410

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$13.789

$12.410

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IDEA Electronic Components Group

UK . 283 parts In-Stock

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$17.347

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$15.612

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283

$17.347

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$15.612

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MKK Technologies

India . 1,911 parts In-Stock

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$32.619

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$32.619

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DigiPath Technology Company

USA . 1,911 parts In-Stock

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$32.619

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$32.619

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Corphita

USA . 939 parts In-Stock

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Parana Technologies

USA . 638 parts In-Stock

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$20.740

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638

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$20.740

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Overview

Unlock seamless communication in your electronic designs with the 74V1T384CTR from STMicroelectronics. Renowned for quality and innovation, STMicroelectronics delivers a powerful bus driver and transceiver that excels in high-performance applications. With its compact design and rapid propagation delay, this device ensures efficient data transmission while operating reliably under extreme conditions. Experience enhanced durability, superior reliability, and optimized performance, making your projects not just functional but exceptional!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, ensuring the reliability of the device.

Surface Mount: YES

Surface mount technology allows for a compact design and is ideal for modern manufacturing processes, resulting in improved performance and reduced space consumption.

Package Shape: RECTANGULAR

The rectangular shape enhances the product's compatibility with various PCB layouts, making integration easier.

Nominal Supply Voltage / Vsup: 5 V

The nominal supply voltage of 5 V ensures compatibility with a wide range of systems and components, simplifying design considerations.

Power Supplies (V): 5

Having a consistent power supply requirement streamlines circuit design and ensures reliable operation.

No. of Terminals: 5

Five terminals provide versatility in connections, allowing for flexible application in various circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch allow for space-efficient designs, essential for compact electronic devices.

Propagation Delay (tpd): 2 ns

A low propagation delay of 2 ns ensures fast signal transmission, which is crucial for high-speed applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows the device to function reliably in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output enables more flexible circuit designs, allowing for better control in multi-device interfaces.

Minimum Operating Temperature: -55 °C

A wide temperature range from -55 °C makes the product suitable for use in extreme conditions, ideal for military and aerospace applications.

Terminal Position: DUAL

The dual terminal position allows for efficient layout of connections, enhancing circuit design flexibility.

No. of Ports: 2

Two ports allow for direct communication between devices, increasing versatility in multi-device configurations.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm is conducive for surface mounting, allowing for slimmer profiles in electronic devices.

Width: 1.25 mm

Compact width ensures minimal PCB footprint, facilitating space savings in electronic designs.

Output Polarity: TRUE

True output polarity ensures consistent performance and simplifies logic design.

Minimum Supply Voltage (Vsup): 4 V

The minimum supply voltage of 4 V offers flexibility in operation, accommodating various voltage architectures.

Length: 2 mm

A length of only 2 mm contributes to the compact size, making it suitable for densely packaged circuits.

Temperature Grade: MILITARY

The military-grade rating assures durability and reliability, ideal for sensitive defense and aerospace applications.

Technology: CMOS

CMOS technology ensures low power consumption and increased performance, making it suitable for energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals enhance soldering stability and streamline the manufacturing process, ensuring robust physical connections.

Packing Method: TR

The tray packing method facilitates easy handling and automated assembly processes, improving overall production efficiency.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density arrangements, maximizing the efficiency of PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides a safety margin for operation, enhancing device reliability across varying conditions.

Technical Specifications

Bus Driver & Transceivers 74V1T384CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

Length:

2 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay (tpd):

2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V1T384CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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