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74V1T125S

STMicroelectronics

74V1T125S by STMicroelectronics

74V1T125S by STMicroelectronics is a bus driver & transceiver with 8.5 ns propagation delay, 5V nominal voltage, and 50 pF load capacitance. It is used in applications requiring true output polarity, dual terminal position, and military-grade temperature tolerance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,367 parts In-Stock

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2,367

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Digiode

USA . 1,766 parts In-Stock

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1,766

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Martec Srl

Italy . 212 parts In-Stock

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212

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Vyrian

USA . 193 parts In-Stock

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193

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Distributors (Availability)

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Andel Nordic

Denmark . 3,182 parts In-Stock

1+ parts

$8.772

100+ parts

-

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$8.421

10k+ parts

$8.421

3,182

$8.772

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$8.421

$8.421

IDEA Electronic Components Group

UK . 84 parts In-Stock

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$8.936

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$8.042

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84

$8.936

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$8.042

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MKK Technologies

India . 713 parts In-Stock

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$16.803

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713

$16.803

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DigiPath Technology Company

USA . 713 parts In-Stock

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$16.803

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713

$16.803

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Parana Technologies

USA . 2,013 parts In-Stock

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$10.684

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$10.684

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Corphita

USA . 1,622 parts In-Stock

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1,622

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Northwest PG Solutions

USA . 289 parts In-Stock

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Native Components

USA . 253 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the STMicroelectronics 74V1T125S Bus Driver & Transceivers. Crafted with precision by a leading manufacturer in the industry, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this compact device delivers fast propagation delay and low power consumption, making it a valuable asset for your projects. Experience the advantages of true output polarity, 3-state output characteristics, and military-grade temperature tolerance. Upgrade your systems with the 74V1T125S and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures efficient communication and data transmission, ideal for quick response times in bus driver applications.

Surface Mount: YES

Surface mounting capability allows for easy installation and space-saving design, making it suitable for compact bus driver and transceiver setups.

Nominal Supply Voltage / Vsup (V): 5

Compatibility with a standard 5V supply voltage ensures the product can be easily integrated into existing systems without the need for additional power sources.

Load Capacitance (CL): 50 pF

The low load capacitance minimizes signal distortion and ensures reliable signal transmission, especially in high-speed communication applications.

No. of Terminals: 5

A sufficient number of terminals allow for versatile connectivity options and signal routing capabilities, enhancing the product's flexibility in bus driver and transceiver configurations.

Maximum I (ol): 8 Amp

High maximum output current capability enables the product to drive larger loads, making it suitable for bus driver applications that require driving multiple devices or components.

Output Characteristics: 3-STATE

The 3-state output allows for the tri-state control of the output signal, providing flexibility in managing the bus communication lines and reducing interference in multi-node bus systems.

Temperature Grade: MILITARY

Military-grade temperature range ensures reliable operation in extreme environments and harsh conditions, making the product suitable for rugged applications in the military or aerospace industries.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noise-sensitive bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers 74V1T125S attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V1T125S Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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